Youichi Andoh

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball supplying method and supplying device
- Patent number 7,357,295
- Issue date Apr 15, 2008
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for applying liquid material
- Patent number 7,267,839
- Issue date Sep 11, 2007
- TDK Corporation
- Koji Tanaka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Solder ball bonding method and bonding device
- Patent number 7,164,097
- Issue date Jan 16, 2007
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solder ball bonding method and bonding device
- Publication number 20050051521
- Publication date Mar 10, 2005
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball supplying method and supplying device
- Publication number 20050045701
- Publication date Mar 3, 2005
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of and apparatus for applying liquid material
- Publication number 20050045653
- Publication date Mar 3, 2005
- TDK Corporation
- Koji Tanaka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...