Youichi Hosokawa

Person

Ichihara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition, process for producing the same, adhesive film...
- Patent number 8,119,737
- Issue date Feb 21, 2012
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device by adhering circuit substrate with adhesive fi...
- Patent number 7,947,779
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
- Patent number 7,449,076
- Issue date Nov 11, 2008
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
- Patent number 7,273,654
- Issue date Sep 25, 2007
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
- Patent number 6,523,446
- Issue date Feb 25, 2003
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20140332984
- Publication date Nov 13, 2014
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20120080808
- Publication date Apr 5, 2012
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110187006
- Publication date Aug 4, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110021005
- Publication date Jan 27, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20090186955
- Publication date Jul 23, 2009
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING L...
- Publication number 20090022893
- Publication date Jan 22, 2009
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20070036971
- Publication date Feb 15, 2007
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060106166
- Publication date May 18, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060100315
- Publication date May 11, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Punched adhesive tape for semiconductor, method of manufacturing le...
- Publication number 20060027312
- Publication date Feb 9, 2006
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive composition , process for producing the same, adhesive fil...
- Publication number 20030069331
- Publication date Apr 10, 2003
- Inada Teiichi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Punched adhesive tape for semiconductor, method of manufacturing le...
- Publication number 20030021990
- Publication date Jan 30, 2003
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS

Youichi Hosokawa

Person

Patents Grantslast 30 patents

Adhesive composition, process for producing the same, adhesive film...

Semiconductor device by adhering circuit substrate with adhesive fi...

Punched adhesive tape for semiconductor, method of manufacturing le...

Punched adhesive tape for semiconductor, method of manufacturing le...

Punched adhesive tape for semiconductor, method of manufacturing le...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING L...

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, process for producing the same, adhesive film...

Punched adhesive tape for semiconductor, method of manufacturing le...

Adhesive composition , process for producing the same, adhesive fil...

Punched adhesive tape for semiconductor, method of manufacturing le...