Youn-Soo Seo

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Inductor device and method of manufacturing the same
- Patent number 11,769,622
- Issue date Sep 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- In-Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor and method of manufacturing the same
- Patent number 11,087,916
- Issue date Aug 10, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Seok Young Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image forming apparatus capable of providing location-based service...
- Patent number 10,805,499
- Issue date Oct 13, 2020
- Hewlett-Packard Development Company, L.P.
- Sung-Joon Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Coil component and method for manufacturing the same
- Patent number 10,586,648
- Issue date Mar 10, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method for manufacturing the same
- Patent number 10,529,476
- Issue date Jan 7, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Ho Sik Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film type inductor and method of manufacturing the same
- Patent number 10,304,620
- Issue date May 28, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong-Sam Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component and manufacturing method thereof
- Patent number 10,102,964
- Issue date Oct 16, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip electronic component and manufacturing method thereof
- Patent number 9,966,178
- Issue date May 8, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Youn-Soo Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board using paste bump and manufacturing method the...
- Patent number 7,973,248
- Issue date Jul 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IMAGE FORMING APPARATUS CAPABLE OF PROVIDING LOCATION-BASED SERVICE...
- Publication number 20190356808
- Publication date Nov 21, 2019
- Hewlett-Packard Development Company, L.P.
- Sung-Joon PARK
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INDUCTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190295763
- Publication date Sep 26, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seok Young CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190139696
- Publication date May 9, 2019
- Samsung Electro-Mechanics Co., Ltd.
- In-Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180268988
- Publication date Sep 20, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180158584
- Publication date Jun 7, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ho Sik PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160293320
- Publication date Oct 6, 2016
- Samsung Electro-Mechanics Co., Ltd.
- In-Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160276094
- Publication date Sep 22, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Yong-Sam Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20160247624
- Publication date Aug 25, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Youn-Soo SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20160240296
- Publication date Aug 18, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20090064497
- Publication date Mar 12, 2009
- Samsung Electro-Mechanics Co.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20080283288
- Publication date Nov 20, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20070107934
- Publication date May 17, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Youn-Soo Seo

Person

Patents Grantslast 30 patents

Inductor device and method of manufacturing the same

Inductor and method of manufacturing the same

Image forming apparatus capable of providing location-based service...

Coil component and method for manufacturing the same

Coil component and method for manufacturing the same

Thin film type inductor and method of manufacturing the same

Coil electronic component and manufacturing method thereof

Chip electronic component and manufacturing method thereof

Printed circuit board using paste bump and manufacturing method the...

Patents Applicationslast 30 patents

IMAGE FORMING APPARATUS CAPABLE OF PROVIDING LOCATION-BASED SERVICE...

INDUCTOR AND METHOD OF MANUFACTURING THE SAME

INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INDUCTOR AND METHOD OF MANUFACTURING THE SAME

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Printed circuit board using paste bump and manufacturing method the...

Printed circuit board using paste bump and manufacturing method the...

Printed circuit board using paste bump and manufacturing method the...