YOUN SUNG KO

Person

CHUNGCHEONGNAM-DO, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip bonding apparatus using VCSEL device
- Patent number 11,810,890
- Issue date Nov 7, 2023
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting conductive ball
- Patent number 10,804,239
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting conductive ball
- Patent number 10,804,240
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attaching apparatus
- Patent number 7,650,687
- Issue date Jan 26, 2010
- Samsung Electronics Co., Ltd.
- Jung-Hwan Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for detaching a semiconductor chip from a tape
- Patent number 7,624,498
- Issue date Dec 1, 2009
- Samsung Electronics Co., Ltd.
- Youn-sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and method for clamping a wire
- Patent number 7,481,351
- Issue date Jan 27, 2009
- Samsung Electronics Co., Ltd.
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240332233
- Publication date Oct 3, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240314939
- Publication date Sep 19, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING
- Publication number 20240178182
- Publication date May 30, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL
- Publication number 20240009747
- Publication date Jan 11, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALLS USING ELECTROSTATIC CHUCK
- Publication number 20230093905
- Publication date Mar 30, 2023
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR LASER BONDING OF FLIP CHIP
- Publication number 20220052019
- Publication date Feb 17, 2022
- PROTEC CO., LTD.
- YOUN SUNG KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP BONDING APPARATUS USING VCSEL DEVICE
- Publication number 20210335748
- Publication date Oct 28, 2021
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MOUNTING CONDUCTIVE BALL
- Publication number 20200144219
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20200144220
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR DETACHING CHIP
- Publication number 20150279716
- Publication date Oct 1, 2015
- PROTEC CO., LTD.
- YOUN SUNG KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE
- Publication number 20100037445
- Publication date Feb 18, 2010
- Samsung Electronics Co., Ltd.
- Youn-sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING DETECTING DEVICE FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20080090311
- Publication date Apr 17, 2008
- Samsung Electronics Co., Ltd.
- Dong-joo ROH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE
- Publication number 20070293022
- Publication date Dec 20, 2007
- Samsung Electronics Co., Ltd.
- Youn-sung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SENSING SHAPE OF CHIP
- Publication number 20070277128
- Publication date Nov 29, 2007
- Samsung Electronics Co., Ltd.
- Dong-Chul HAN
- G01 - MEASURING TESTING
Information Patent Application
Multi-chip die bonder and method
- Publication number 20060266792
- Publication date Nov 30, 2006
- Youn-Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die attaching apparatus, and system and method for cleaning the same
- Publication number 20060048381
- Publication date Mar 9, 2006
- Jung-Hwan Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus and method for clamping a wire
- Publication number 20050133563
- Publication date Jun 23, 2005
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

YOUN SUNG KO

Person

Patents Grantslast 30 patents

Flip-chip bonding apparatus using VCSEL device

Apparatus for mounting conductive ball

Method of mounting conductive ball

Die attaching apparatus

Apparatus for detaching a semiconductor chip from a tape

Wire bonding apparatus and method for clamping a wire

Patents Applicationslast 30 patents

METHOD OF BONDING COLUMN TYPE DEPOSITS

METHOD OF BONDING COLUMN TYPE DEPOSITS

APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING

HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL

METHOD OF MOUNTING CONDUCTIVE BALLS USING ELECTROSTATIC CHUCK

SYSTEM FOR LASER BONDING OF FLIP CHIP

FLIP-CHIP BONDING APPARATUS USING VCSEL DEVICE

APPARATUS FOR MOUNTING CONDUCTIVE BALL

METHOD OF MOUNTING CONDUCTIVE BALL

APPARATUS AND METHOD FOR DETACHING CHIP

METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE

DIPPING DETECTING DEVICE FOR FABRICATING A SEMICONDUCTOR DEVICE

METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE

SYSTEM AND METHOD FOR SENSING SHAPE OF CHIP

Multi-chip die bonder and method

Die attaching apparatus, and system and method for cleaning the same

Wire bonding apparatus and method for clamping a wire