Young A. Jee

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of inspection of semiconductor packages including measureme...
- Patent number 11,935,873
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,621,250
- Issue date Apr 4, 2023
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having redistribution layer
- Patent number 11,488,910
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having dummy pads and method of manufacturing...
- Patent number 11,282,792
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,227,855
- Issue date Jan 18, 2022
- Samsung Electronics Co., Ltd.
- Jang-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including stacked substrates and penetration...
- Patent number 11,222,873
- Issue date Jan 11, 2022
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having redistribution layer
- Patent number 10,818,603
- Issue date Oct 27, 2020
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module including a channel for controlling warpa...
- Patent number 10,685,921
- Issue date Jun 16, 2020
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicular shock absorber and method for controlling same
- Patent number 10,539,202
- Issue date Jan 21, 2020
- Mando Corporation
- Young Hwan Jee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor device having stacked semiconductor chips interconnec...
- Patent number 10,020,290
- Issue date Jul 10, 2018
- Samsung Electronics Co., Ltd.
- Yeong-Hwan Choe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips interconnec...
- Patent number 9,721,926
- Issue date Aug 1, 2017
- Samsung Electronics Co., Ltd.
- Yeong-Hwan Choe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,721,930
- Issue date Aug 1, 2017
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 9,589,947
- Issue date Mar 7, 2017
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package
- Patent number 9,543,276
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Young-kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film and non-conductive paste including zinc particl...
- Patent number 9,376,541
- Issue date Jun 28, 2016
- Samsung Electronics Co., Ltd.
- Un-byoung Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,324,683
- Issue date Apr 26, 2016
- Samsung Electronics Co., Ltd.
- Tae-Hong Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damping force controlling valve assembly for shock absorber
- Patent number 9,261,162
- Issue date Feb 16, 2016
- Mando Corporation
- Young Whan Jee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor packages having TSV and adhesive layer
- Patent number 9,159,651
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate of semiconductor package and method of fabricating semico...
- Patent number 9,082,871
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Gi-Jun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate of semiconductor package and method of fabricating semico...
- Patent number 8,987,904
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Gi-Jun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages, methods of manufacturing the same, and semi...
- Patent number 8,802,495
- Issue date Aug 12, 2014
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an anti-contact layer
- Patent number 8,742,577
- Issue date Jun 3, 2014
- Samsung Electronics Co., Ltd.
- Young-kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damping force controlling valve assembly for shock absorber
- Patent number 8,556,049
- Issue date Oct 15, 2013
- Mando Corporation
- Young Whan Jee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Damping force variable valve and shock absorber including the same
- Patent number 8,220,604
- Issue date Jul 17, 2012
- Mando Corporation
- Young Whan Jee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Solenoid valve of shock absorber
- Patent number 7,896,311
- Issue date Mar 1, 2011
- Mando Corporation
- Young Hwan Jee
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Variable damping valve of shock absorber
- Patent number 7,407,044
- Issue date Aug 5, 2008
- Mando Corporation
- Young Whan Jee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Process for preparing YBa.sub.2 Cu.sub.3 O.sub.7-x superconductors
- Patent number 5,525,585
- Issue date Jun 11, 1996
- Korea Advanced Institute of Science and Technology
- Jeong-Hun Suh
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240332256
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194639
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240170459
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Bo Hee HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105679
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20240071942
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Young kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240014177
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Young Kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230207532
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...
- Publication number 20220173044
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220130802
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220102315
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Jang-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210183816
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER
- Publication number 20210020578
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Young Kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...
- Publication number 20210005553
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200118972
- Publication date Apr 16, 2020
- Samsung Electronics Co., Ltd.
- Jang-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200075561
- Publication date Mar 5, 2020
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MODULE INCLUDING A CHANNEL FOR CONTROLLING WARPA...
- Publication number 20200020647
- Publication date Jan 16, 2020
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER
- Publication number 20200006242
- Publication date Jan 2, 2020
- Samsung Electronics Co., Ltd.
- Young Kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICULAR SHOCK ABSORBER AND METHOD FOR CONTROLLING SAME
- Publication number 20180266510
- Publication date Sep 20, 2018
- Mando Corporation
- Young Hwan JEE
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Semiconductor Device Having Stacked Semiconductor Chips Interconnec...
- Publication number 20170330862
- Publication date Nov 16, 2017
- Yeong-Hwan CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170005075
- Publication date Jan 5, 2017
- Samsung Electronics Co., Ltd.
- Hyoungjoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20160064357
- Publication date Mar 3, 2016
- Yeong-Hwan CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE
- Publication number 20160056101
- Publication date Feb 25, 2016
- Young-kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...
- Publication number 20150155259
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- Gi-Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM AND NON-CONDUCTIVE PASTE INCLUDING ZINC PARTICL...
- Publication number 20150102485
- Publication date Apr 16, 2015
- Korea Advanced Institute of Science and Technology
- Un-byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150093857
- Publication date Apr 2, 2015
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150048493
- Publication date Feb 19, 2015
- Samsung Electronics Co., Ltd.
- Tae-Hong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TSV AND ADHESIVE LAYER
- Publication number 20140291854
- Publication date Oct 2, 2014
- Samsung Electronics Co., Ltd.
- Teak-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMI...
- Publication number 20140038353
- Publication date Feb 6, 2014
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...
- Publication number 20140008794
- Publication date Jan 9, 2014
- Samsung Electronics Co., Ltd.
- Gi-Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TREATING A DEVICE-SUBSTRATE AND SUPPORT-SUBSTRATES USED...
- Publication number 20130330925
- Publication date Dec 12, 2013
- Samsung Electronics Co., Ltd.
- Tae Hong MIN
- H01 - BASIC ELECTRIC ELEMENTS

Young A. Jee

Person

Patents Grantslast 30 patents

Methods of inspection of semiconductor packages including measureme...

Semiconductor packages

Semiconductor package having redistribution layer

Semiconductor package having dummy pads and method of manufacturing...

Semiconductor package

Semiconductor packages including stacked substrates and penetration...

Semiconductor package having redistribution layer

Semiconductor chip module including a channel for controlling warpa...

Vehicular shock absorber and method for controlling same

Semiconductor device having stacked semiconductor chips interconnec...

Semiconductor device having stacked semiconductor chips interconnec...

Semiconductor package and method for fabricating the same

Semiconductor packages and methods of manufacturing the same

Chip-stacked semiconductor package

Non-conductive film and non-conductive paste including zinc particl...

Semiconductor package and method of manufacturing the same

Damping force controlling valve assembly for shock absorber

Semiconductor packages having TSV and adhesive layer

Substrate of semiconductor package and method of fabricating semico...

Substrate of semiconductor package and method of fabricating semico...

Semiconductor packages, methods of manufacturing the same, and semi...

Semiconductor package having an anti-contact layer

Damping force controlling valve assembly for shock absorber

Damping force variable valve and shock absorber including the same

Solenoid valve of shock absorber

Variable damping valve of shock absorber

Process for preparing YBa.sub.2 Cu.sub.3 O.sub.7-x superconductors

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER

SEMICONDUCTOR PACKAGE HAVING DUMMY PADS AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP MODULE INCLUDING A CHANNEL FOR CONTROLLING WARPA...

SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER

VEHICULAR SHOCK ABSORBER AND METHOD FOR CONTROLLING SAME

Semiconductor Device Having Stacked Semiconductor Chips Interconnec...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CHIP-STACKED SEMICONDUCTOR PACKAGE

SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...

NON-CONDUCTIVE FILM AND NON-CONDUCTIVE PASTE INCLUDING ZINC PARTICL...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES HAVING TSV AND ADHESIVE LAYER

SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMI...

SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICO...

METHODS OF TREATING A DEVICE-SUBSTRATE AND SUPPORT-SUBSTRATES USED...