Young-Chang LIEN

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Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Methods of dicing a semiconductor structure
- Patent number 8,048,778
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Yu Ku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for forming pillar bump structure having sidew...
- Patent number 7,919,406
- Issue date Apr 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD FOR FORMING PILLAR BUMP STRUCTURE HAVING SIDEW...
- Publication number 20110006416
- Publication date Jan 13, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Hung TSENG
- H01 - BASIC ELECTRIC ELEMENTS