Young-Do Kweon

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming a metallurgical intercon...
- Patent number 9,312,150
- Issue date Apr 12, 2016
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnecting a chip and a substrate by bonding pure metal bumps...
- Patent number 8,119,450
- Issue date Feb 21, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-coplanarity bumping shape for flip-chip
- Patent number 7,407,877
- Issue date Aug 5, 2008
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-coplanarity bumping shape for flip chip
- Patent number 7,211,901
- Issue date May 1, 2007
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-coplanarity bumping shape for flip chip
- Patent number 6,940,178
- Issue date Sep 6, 2005
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package with flip chip interconnect
- Patent number 6,737,295
- Issue date May 18, 2004
- ChipPAC, Inc.
- Rajendra Pendse
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20130113093
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20120049357
- Publication date Mar 1, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Method
- Publication number 20090227072
- Publication date Sep 10, 2009
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method
- Publication number 20060255474
- Publication date Nov 16, 2006
- ChipPAC, Inc.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-coplanarity bumping shape for flip chip
- Publication number 20050218515
- Publication date Oct 6, 2005
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making self-coplanarity bumping shape for flip chip
- Publication number 20050221535
- Publication date Oct 6, 2005
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package with flip chip interconnect
- Publication number 20040222440
- Publication date Nov 11, 2004
- ChipPAC, Inc.
- Rajendra Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package with flip chip interconnect
- Publication number 20020151189
- Publication date Oct 17, 2002
- ChipPAC, Inc.
- Rajendra Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-coplanarity bumping shape for flip chip
- Publication number 20020151228
- Publication date Oct 17, 2002
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method
- Publication number 20020014702
- Publication date Feb 7, 2002
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS

Young-Do Kweon

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming a metallurgical intercon...

Interconnecting a chip and a substrate by bonding pure metal bumps...

Self-coplanarity bumping shape for flip-chip

Self-coplanarity bumping shape for flip chip

Self-coplanarity bumping shape for flip chip

Chip scale package with flip chip interconnect

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming a Metallurgical Intercon...

Semiconductor Device and Method of Forming a Metallurgical Intercon...

Packaging Structure and Method

Packaging structure and method

Self-coplanarity bumping shape for flip chip

Method for making self-coplanarity bumping shape for flip chip

Chip scale package with flip chip interconnect

Chip scale package with flip chip interconnect

Self-coplanarity bumping shape for flip chip

Packaging structure and method