Young Do Kweon

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier assisted substrate method of manufacturing an electronic de...
- Patent number 12,051,611
- Issue date Jul 30, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 11,410,935
- Issue date Aug 9, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier assisted substrate method of manufacturing an electronic de...
- Patent number 11,018,040
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 10,672,715
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 10,083,931
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,240,385
- Issue date Jan 19, 2016
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 8,922,002
- Issue date Dec 30, 2014
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices
- Patent number 8,138,613
- Issue date Mar 20, 2012
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating microelectronic devices
- Patent number 7,910,385
- Issue date Mar 22, 2011
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 7,749,882
- Issue date Jul 6, 2010
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240006393
- Publication date Jan 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20220375807
- Publication date Nov 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20220059387
- Publication date Feb 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20200402830
- Publication date Dec 24, 2020
- Amkor Technology, Inc.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20200303315
- Publication date Sep 24, 2020
- Amkor Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20190318994
- Publication date Oct 17, 2019
- Amkor Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20180358324
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20160086910
- Publication date Mar 24, 2016
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20150118796
- Publication date Apr 30, 2015
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...
- Publication number 20110169154
- Publication date Jul 14, 2011
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20100237494
- Publication date Sep 23, 2010
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods for manufacturing pack...
- Publication number 20080050901
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices and methods for manufacturing microelectron...
- Publication number 20070262436
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS

Young Do Kweon

Person

Patents Grantslast 30 patents

Semiconductor package using cavity substrate and manufacturing methods

Carrier assisted substrate method of manufacturing an electronic de...

Semiconductor package using cavity substrate and manufacturing methods

Packaged microelectronic devices having stacked interconnect elemen...

Carrier assisted substrate method of manufacturing an electronic de...

Semiconductor package using cavity substrate and manufacturing methods

Packaged microelectronic devices having stacked interconnect elemen...

Packaged microelectronic devices and methods for manufacturing pack...

Packaged microelectronic devices and methods for manufacturing pack...

Microelectronic devices

Method of fabricating microelectronic devices

Packaged microelectronic devices and methods for manufacturing pack...

Patents Applicationslast 30 patents

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

Packaged microelectronic devices and methods for manufacturing pack...

Microelectronic devices and methods for manufacturing microelectron...