Young Hee RO

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and semiconductor package using the same
- Patent number 9,502,341
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Jik-Ho Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package
- Patent number 8,446,018
- Issue date May 21, 2013
- Samsung Electronics Co., Ltd.
- Woo-Jae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helical springs electrical connecting a plurality of packages
- Patent number 8,274,144
- Issue date Sep 25, 2012
- Samsung Electronics Co., Ltd.
- Young-Hoon Ro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal PCB and smart card using the same
- Patent number 7,855,895
- Issue date Dec 21, 2010
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal PCB and smart card using the same
- Patent number 7,630,209
- Issue date Dec 8, 2009
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state imaging apparatus, wiring substrate and methods of manu...
- Patent number 7,579,583
- Issue date Aug 25, 2009
- Samsung Electronics Co., Ltd.
- Seung-Kon Mok
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image pickup device with non-molded DSP chip and manufacturing method
- Patent number 7,405,760
- Issue date Jul 29, 2008
- Samsung Electronics Co., Ltd.
- Min Kyo Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package having dam and method for fabricating the same
- Patent number 6,891,259
- Issue date May 10, 2005
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having one or more sealing screws
- Patent number 6,608,380
- Issue date Aug 19, 2003
- Samsung Electronics Co., Ltd.
- Young-Hoon Ro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ground projections
- Patent number 6,518,660
- Issue date Feb 11, 2003
- Samsung Electronics Co., Ltd.
- Heung Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HAPPY FACTOR SERVICE SYSTEM AND METHOD OF PROVIDING HAPPY FACTOR SE...
- Publication number 20170039195
- Publication date Feb 9, 2017
- Young Hee RO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20160049379
- Publication date Feb 18, 2016
- Samsung Electronics Co., Ltd.
- Jik-Ho SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING ELASTIC MEMBERS FOR VIAS, PACKAGE ON PACKAGE COMPRIS...
- Publication number 20120049348
- Publication date Mar 1, 2012
- Samsung Electronics Co., Ltd.
- Young-Hoon Ro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package On Package
- Publication number 20110215471
- Publication date Sep 8, 2011
- Samsung Electronics Co., Ltd.
- Woo-Jae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PCB AND SMART CARD USING THE SAME
- Publication number 20100038438
- Publication date Feb 18, 2010
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Solid-state imaging apparatus and method for manufacturing the same
- Publication number 20090315130
- Publication date Dec 24, 2009
- Young-Hoon Ro
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
UNIVERSAL PCB AND SMART CARD USING THE SAME
- Publication number 20070013396
- Publication date Jan 18, 2007
- Dong-Han KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Substrate applicable to both wire bonding and flip chip bonding, sm...
- Publication number 20070015338
- Publication date Jan 18, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Seok-Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solid-state imaging apparatus, wiring substrate and methods of manu...
- Publication number 20050116142
- Publication date Jun 2, 2005
- Seung-Kon Mok
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor package having DAM and method for fabricating the same
- Publication number 20040036183
- Publication date Feb 26, 2004
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image pickup device and manufacturing method thereof
- Publication number 20030234886
- Publication date Dec 25, 2003
- Min Kyo Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor package having dam and method for fabricating the same
- Publication number 20030085475
- Publication date May 8, 2003
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages
- Publication number 20020113306
- Publication date Aug 22, 2002
- Heung Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and manufacturing method thereof
- Publication number 20020041018
- Publication date Apr 11, 2002
- Samsung Electronics Co., Ltd.
- Young-Hoon Ro
- H01 - BASIC ELECTRIC ELEMENTS

Young Hee RO

Person

Patents Grantslast 30 patents

Printed circuit board and semiconductor package using the same

Package on package

Helical springs electrical connecting a plurality of packages

Universal PCB and smart card using the same

Universal PCB and smart card using the same

Solid-state imaging apparatus, wiring substrate and methods of manu...

Image pickup device with non-molded DSP chip and manufacturing method

Semiconductor package having dam and method for fabricating the same

Semiconductor chip package having one or more sealing screws

Semiconductor package with ground projections

Patents Applicationslast 30 patents

HAPPY FACTOR SERVICE SYSTEM AND METHOD OF PROVIDING HAPPY FACTOR SE...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

PACKAGE HAVING ELASTIC MEMBERS FOR VIAS, PACKAGE ON PACKAGE COMPRIS...

Package On Package

UNIVERSAL PCB AND SMART CARD USING THE SAME

Solid-state imaging apparatus and method for manufacturing the same

UNIVERSAL PCB AND SMART CARD USING THE SAME

Substrate applicable to both wire bonding and flip chip bonding, sm...

Solid-state imaging apparatus, wiring substrate and methods of manu...

Semiconductor package having DAM and method for fabricating the same

Image pickup device and manufacturing method thereof

Semiconductor package having dam and method for fabricating the same

Semiconductor packages

Semiconductor chip package and manufacturing method thereof