Young-Houng Shiao

Person

Hsin-Chu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor packaging structure with black encapsulant
- Patent number 8,928,104
- Issue date Jan 6, 2015
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with casing including a vent without...
- Patent number 8,847,146
- Issue date Sep 30, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image sensor packaging structure and manufacturing meth...
- Patent number 8,828,777
- Issue date Sep 9, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of molded image sensor packaging structure wit...
- Patent number 8,481,343
- Issue date Jul 9, 2013
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure with predetermined focal length
- Patent number 8,441,086
- Issue date May 14, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with large air cavity
- Patent number 8,390,087
- Issue date Mar 5, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and structure of a wafer level image sensor mo...
- Patent number 8,378,441
- Issue date Feb 19, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for molding image sensor package structure and...
- Patent number 8,093,674
- Issue date Jan 10, 2012
- Kingpak Technology, Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...
- Publication number 20120068288
- Publication date Mar 22, 2012
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20110241147
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MO...
- Publication number 20110241146
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT
- Publication number 20110156188
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH
- Publication number 20110156187
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...
- Publication number 20110024861
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY
- Publication number 20110024862
- Publication date Feb 3, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE
- Publication number 20110024610
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS

Young-Houng Shiao

Person

Patents Grantslast 30 patents

Image sensor packaging structure with black encapsulant

Image sensor package structure with casing including a vent without...

Wafer level image sensor packaging structure and manufacturing meth...

Manufacturing method of molded image sensor packaging structure wit...

Image sensor packaging structure with predetermined focal length

Image sensor package structure with large air cavity

Manufacturing method and structure of a wafer level image sensor mo...

Manufacturing method for molding image sensor package structure and...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...

WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...

MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MO...

IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT

IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH

MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...

IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY

IMAGE SENSOR PACKAGE STRUCTURE