Young-Kyun Sun

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus and method for clamping a wire
- Patent number 7,481,351
- Issue date Jan 27, 2009
- Samsung Electronics Co., Ltd.
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-line apparatus and method for manufacturing double-sided stacked...
- Patent number 7,215,008
- Issue date May 8, 2007
- Samsung Electronics Co., Ltd.
- Tae-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-line die attaching and curing apparatus for a multi-chip package
- Patent number 7,074,646
- Issue date Jul 11, 2006
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-line die attaching and curing apparatus for a multi-chip package
- Patent number 6,863,109
- Issue date Mar 8, 2005
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
In-line apparatus and method for manufacturing double-sided stacked...
- Publication number 20070170569
- Publication date Jul 26, 2007
- Tae-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus and method for clamping a wire
- Publication number 20050133563
- Publication date Jun 23, 2005
- Tae-Hyun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
In-line die attaching and curing apparatus for a multi-chip package
- Publication number 20050106778
- Publication date May 19, 2005
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for testing semiconductor devices
- Publication number 20050012498
- Publication date Jan 20, 2005
- Soo-Chan Lee
- G01 - MEASURING TESTING
Information Patent Application
In-line apparatus and method for manufacturing double-sided stacked...
- Publication number 20050006743
- Publication date Jan 13, 2005
- Tae-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-line die attaching and curing apparatus for a multi-chip package
- Publication number 20040108582
- Publication date Jun 10, 2004
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS