Young Min Jun

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Cheongju-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor die with die region and seal-ring...
- Patent number 11,887,892
- Issue date Jan 30, 2024
- MagnaChip Semiconductor, Ltd.
- Jin Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trip device
- Patent number 8,274,355
- Issue date Sep 25, 2012
- LS Industrial Systems Co., Ltd.
- Young Min Jun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF
- Publication number 20240128123
- Publication date Apr 18, 2024
- Magnachip Semiconductor, Ltd.
- Jin Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF
- Publication number 20220005733
- Publication date Jan 6, 2022
- Magnachip Semiconductor, Ltd.
- Jin Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIP DEVICE
- Publication number 20100164676
- Publication date Jul 1, 2010
- LS INDUSTRIAL SYSTEMS CO, LTD.
- Young Min Jun
- H01 - BASIC ELECTRIC ELEMENTS