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Young Wook Heo
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Phoenix, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stackable semiconductor package
Patent number
8,466,545
Issue date
Jun 18, 2013
Amkor Technology, Inc.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package
Patent number
8,227,905
Issue date
Jul 24, 2012
Amkor Technology, Inc.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package
Patent number
7,982,306
Issue date
Jul 19, 2011
Amkor Technology, Inc.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package
Patent number
7,737,542
Issue date
Jun 15, 2010
Amkor Technology, Inc.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a stack of semiconductor packages
Patent number
7,459,349
Issue date
Dec 2, 2008
Amkor Technology, Inc.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package with solder on pads on which second...
Patent number
6,987,314
Issue date
Jan 17, 2006
Amkor Technology, Inc.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having one or more die stacked on a prepackag...
Patent number
6,946,323
Issue date
Sep 20, 2005
Amkor Technology, Inc.
Young Wook Heo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking structure for semiconductor devices using a folded over fl...
Patent number
6,879,047
Issue date
Apr 12, 2005
Amkor Technology, Inc.
Young Wook Heo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having stacked semiconductor chips and method...
Patent number
6,555,917
Issue date
Apr 29, 2003
Amkor Technology, Inc.
Young Wook Heo
H01 - BASIC ELECTRIC ELEMENTS