Youngbok Kim

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for wafer level package and semiconductor device fabricated...
- Patent number 8,558,371
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method For Wafer Level Package and Semiconductor Device Fabricated...
- Publication number 20110233706
- Publication date Sep 29, 2011
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS