Youngchul Kim

Person

Kyoungki-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,721,921
- Issue date Aug 1, 2017
- STATS ChipPAC Pte. Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-in package-on-pack...
- Patent number 9,559,046
- Issue date Jan 31, 2017
- STATS ChipPAC Pte. Ltd.
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of individual die bonding followed...
- Patent number 9,524,958
- Issue date Dec 20, 2016
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with surface treatment and meth...
- Patent number 9,385,100
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Hun Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,287,204
- Issue date Mar 15, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing flip chip semiconductor packages using dou...
- Patent number 9,252,130
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of simultaneous molding and thermal...
- Patent number 9,245,770
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with connection structure and m...
- Patent number 9,202,715
- Issue date Dec 1, 2015
- Stats Chippac Ltd.
- YoungChul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with heat spreader and method o...
- Patent number 9,093,415
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having dual sided connection an...
- Patent number 8,906,740
- Issue date Dec 9, 2014
- Stats Chippac Ltd.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-in-package and met...
- Patent number 8,816,487
- Issue date Aug 26, 2014
- Stats Chippac Ltd.
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacture of inline integrated circuit system
- Patent number 8,501,540
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inline integrated circuit system
- Patent number 7,968,981
- Issue date Jun 28, 2011
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having dual sided connection an...
- Patent number 7,923,290
- Issue date Apr 12, 2011
- Stats Chippac Ltd.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 7,800,211
- Issue date Sep 21, 2010
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Bonding Semiconductor Die to Sub...
- Publication number 20160163675
- Publication date Jun 9, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...
- Publication number 20150084178
- Publication date Mar 26, 2015
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Individual Die Bonding Followed...
- Publication number 20150001703
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Flip Chip Semiconductor Packages Using Dou...
- Publication number 20140295618
- Publication date Oct 2, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Simultaneous Molding and Thermal...
- Publication number 20140175639
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Bonding Semiconductor Die to Sub...
- Publication number 20140175640
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND M...
- Publication number 20120119360
- Publication date May 17, 2012
- YoungChul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM
- Publication number 20110244635
- Publication date Oct 6, 2011
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AN...
- Publication number 20110186994
- Publication date Aug 4, 2011
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package By Using Internal Stacking Modules
- Publication number 20110024890
- Publication date Feb 3, 2011
- STATS ChipPAC, Ltd.
- JoungIn YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AN...
- Publication number 20100244221
- Publication date Sep 30, 2010
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-In Package-on-Pack...
- Publication number 20100065948
- Publication date Mar 18, 2010
- STATS ChipPAC, Ltd.
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE INTEGRATED CIRCUIT SYSTEM
- Publication number 20090258494
- Publication date Oct 15, 2009
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-IN-PACKAGE AND MET...
- Publication number 20090236723
- Publication date Sep 24, 2009
- Hyunil Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20090001540
- Publication date Jan 1, 2009
- STATS ChipPAC, Ltd.
- JoungIn YANG
- H01 - BASIC ELECTRIC ELEMENTS

Youngchul Kim

Person

Patents Grantslast 30 patents

Semiconductor device and method of bonding semiconductor die to sub...

Semiconductor device and method of forming a fan-in package-on-pack...

Semiconductor device and method of individual die bonding followed...

Integrated circuit packaging system with surface treatment and meth...

Semiconductor device and method of bonding semiconductor die to sub...

Methods of manufacturing flip chip semiconductor packages using dou...

Semiconductor device and method of simultaneous molding and thermal...

Stackable package by using internal stacking modules

Semiconductor device and method of making bumpless flipchip interco...

Integrated circuit packaging system with connection structure and m...

Integrated circuit packaging system with heat spreader and method o...

Integrated circuit packaging system having dual sided connection an...

Integrated circuit packaging system with package-in-package and met...

Method for manufacture of inline integrated circuit system

Inline integrated circuit system

Integrated circuit packaging system having dual sided connection an...

Stackable package by using internal stacking modules

Patents Applicationslast 30 patents

Semiconductor Device and Method of Bonding Semiconductor Die to Sub...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...

Semiconductor Device and Method of Individual Die Bonding Followed...

Stackable Package by Using Internal Stacking Modules

Methods of Manufacturing Flip Chip Semiconductor Packages Using Dou...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

Semiconductor Device and Method of Simultaneous Molding and Thermal...

Semiconductor Device and Method of Bonding Semiconductor Die to Sub...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND M...

METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AN...

Stackable Package By Using Internal Stacking Modules

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AN...

Semiconductor Device and Method of Forming a Fan-In Package-on-Pack...

INLINE INTEGRATED CIRCUIT SYSTEM

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-IN-PACKAGE AND MET...

Stackable Package by Using Internal Stacking Modules