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Younggwan Ko

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  • Suwon-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 11,935,847
    • Issue date Mar 19, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package module
    • Patent number 11,842,950
    • Issue date Dec 12, 2023
    • Samsung Electronics Co., Ltd.
    • Yongjin Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 11,837,537
    • Issue date Dec 5, 2023
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,329,014
    • Issue date May 10, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 11,121,079
    • Issue date Sep 14, 2021
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interposer and semiconductor package including the same
    • Patent number 11,088,115
    • Issue date Aug 10, 2021
    • Samsung Electronic Co., Ltd.
    • Jungsoo Byun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 11,049,782
    • Issue date Jun 29, 2021
    • Samsung Electronics Co., Ltd.
    • Hanul Lee
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220262748
    • Publication date Aug 18, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE MODULE
    • Publication number 20220246506
    • Publication date Aug 4, 2022
    • Samsung Electronics Co., Ltd.
    • Yongjin PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    • Publication number 20210366878
    • Publication date Nov 25, 2021
    • Samsung Electronics Co., Ltd.
    • Jungsoo BYUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200312797
    • Publication date Oct 1, 2020
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    • Publication number 20200185357
    • Publication date Jun 11, 2020
    • Samsung Electronics Co., Ltd.
    • Jungsoo BYUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE MODULE
    • Publication number 20200176364
    • Publication date Jun 4, 2020
    • Samsung Electronics Co., Ltd.
    • Yongjin PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE
    • Publication number 20200161237
    • Publication date May 21, 2020
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE
    • Publication number 20200161202
    • Publication date May 21, 2020
    • Samsung Electronics Co., Ltd.
    • Hanul Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE
    • Publication number 20200152569
    • Publication date May 14, 2020
    • Samsung Electronics Co., Ltd.
    • Jeongho Lee
    • H01 - BASIC ELECTRIC ELEMENTS