YoungHoon Ro

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices
- Patent number 11,373,942
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Junyoung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates, semiconductor packages having the package subst...
- Patent number 9,418,914
- Issue date Aug 16, 2016
- Samsung Electronics Co., Ltd.
- YoungHoon Ro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device including guide rings and manufact...
- Patent number 9,018,041
- Issue date Apr 28, 2015
- Samsung Electronics Co., Ltd.
- Han-shin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 8,823,185
- Issue date Sep 2, 2014
- Samsung Electronics Co., Ltd.
- In Won O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device including guide rings and manufact...
- Patent number 8,587,108
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- HanShin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-board package
- Patent number 8,143,713
- Issue date Mar 27, 2012
- Samsung Electronics Co., Ltd.
- Eun-Seok Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20210050291
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Junyoung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE PACKAGE SUBST...
- Publication number 20160322296
- Publication date Nov 3, 2016
- Samsung Electronics Co., Ltd.
- YoungHoon RO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE PACKAGE SUBST...
- Publication number 20140063723
- Publication date Mar 6, 2014
- YoungHoon RO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...
- Publication number 20140051243
- Publication date Feb 20, 2014
- Samsung Electronics Co., Ltd.
- Han-shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120168918
- Publication date Jul 5, 2012
- Samsung Electronics Co., Ltd.
- In Won O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package For Semiconductor Device Including Guide Rings And Manufact...
- Publication number 20120074566
- Publication date Mar 29, 2012
- Samsung Electronics Co., Ltd.
- HanShin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-on-board package
- Publication number 20100270657
- Publication date Oct 28, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Eun-Seok Song
- H01 - BASIC ELECTRIC ELEMENTS

YoungHoon Ro

Person

Patents Grantslast 30 patents

Semiconductor devices

Package substrates, semiconductor packages having the package subst...

Package for semiconductor device including guide rings and manufact...

Semiconductor packages

Package for semiconductor device including guide rings and manufact...

Chip-on-board package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE PACKAGE SUBST...

PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE PACKAGE SUBST...

PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...

SEMICONDUCTOR PACKAGES

Package For Semiconductor Device Including Guide Rings And Manufact...

Chip-on-board package