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Taichung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
Patent number
11,942,455
Issue date
Mar 26, 2024
Micron Technology, Inc.
Yeongbeom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground connection for semiconductor device assembly
Patent number
11,764,161
Issue date
Sep 19, 2023
Micron Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with package-level compartmental shielding an...
Patent number
11,515,174
Issue date
Nov 29, 2022
Micron Technology, Inc.
Youngik Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
Patent number
11,362,071
Issue date
Jun 14, 2022
Micron Technology, Inc.
Yeongbeom Ko
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STRUCTURES AND METHODS FOR DICING SEMICONDUCTOR DEVICES
Publication number
20230290684
Publication date
Sep 14, 2023
Micron Technology, Inc.
Wei Chang Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL COMPARTMENTAL SHIELDING AN...
Publication number
20230041760
Publication date
Feb 9, 2023
Micron Technology, Inc.
Youngik Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20220271013
Publication date
Aug 25, 2022
Micron Technology, Inc.
Yeongbeom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20220059500
Publication date
Feb 24, 2022
Micron Technology, Inc.
Yeongbeom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GROUND CONNECTION FOR SEMICONDUCTOR DEVICE ASSEMBLY
Publication number
20210175182
Publication date
Jun 10, 2021
Micron Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL COMPARTMENTAL SHIELDING AN...
Publication number
20210143073
Publication date
May 13, 2021
Micron Technology, Inc.
Youngik Kwon
H01 - BASIC ELECTRIC ELEMENTS