YoungJoon Kim

Person

Ichon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with chip stacking and method o...
- Patent number 9,530,753
- Issue date Dec 27, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSup Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stacked semiconductor di...
- Patent number 9,318,380
- Issue date Apr 19, 2016
- STATS ChipPAC, Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 8,835,301
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stacked semiconductor di...
- Patent number 8,816,404
- Issue date Aug 26, 2014
- STATS ChipPAC, Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stacked lead and method of...
- Patent number 8,304,900
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mountable integrated circuit package system with intra-stack encaps...
- Patent number 8,247,893
- Issue date Aug 21, 2012
- Stats Chippac Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing thermally enhanced flip-chip ball grid ar...
- Patent number 8,115,301
- Issue date Feb 14, 2012
- Stats Chippac, Inc.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system using bottom flip chip die bond...
- Patent number 8,110,908
- Issue date Feb 7, 2012
- Stats Chippac Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking system with mold contamination prevention
- Patent number 7,898,072
- Issue date Mar 1, 2011
- Stats Chippac Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Stacked Semiconductor Di...
- Publication number 20140322865
- Publication date Oct 30, 2014
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD O...
- Publication number 20130075915
- Publication date Mar 28, 2013
- DaeSup Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stacked Semiconductor Di...
- Publication number 20130069239
- Publication date Mar 21, 2013
- STATS ChipPAC, Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20120217640
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED LEAD AND METHOD OF...
- Publication number 20120038040
- Publication date Feb 16, 2012
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKING SYSTEM WITH MOLD CONTAMINATION PREVENTION AND METH...
- Publication number 20110121465
- Publication date May 26, 2011
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM USING BOTTOM FLIP CHIP DIE BOND...
- Publication number 20100140769
- Publication date Jun 10, 2010
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKING SYSTEM WITH MOLD CONTAMINATION PREVENTION
- Publication number 20100007000
- Publication date Jan 14, 2010
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPS...
- Publication number 20090166886
- Publication date Jul 2, 2009
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for manufacturing thermally enhanced flip-chip ball grid ar...
- Publication number 20080116586
- Publication date May 22, 2008
- STATS ChipPAC, Inc.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS

YoungJoon Kim

Person

Patents Grantslast 30 patents

Integrated circuit packaging system with chip stacking and method o...

Semiconductor device and method of forming stacked semiconductor di...

Semiconductor device and method of forming bump structure with insu...

Semiconductor device and method of forming stacked semiconductor di...

Integrated circuit packaging system with stacked lead and method of...

Mountable integrated circuit package system with intra-stack encaps...

Methods for manufacturing thermally enhanced flip-chip ball grid ar...

Integrated circuit packaging system using bottom flip chip die bond...

Package stacking system with mold contamination prevention

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Stacked Semiconductor Di...

Semiconductor Device and Method of Forming Bump Structure with Insu...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD O...

Semiconductor Device and Method of Forming Stacked Semiconductor Di...

Semiconductor Device and Method of Forming Bump Structure with Insu...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED LEAD AND METHOD OF...

PACKAGE STACKING SYSTEM WITH MOLD CONTAMINATION PREVENTION AND METH...

INTEGRATED CIRCUIT PACKAGING SYSTEM USING BOTTOM FLIP CHIP DIE BOND...

PACKAGE STACKING SYSTEM WITH MOLD CONTAMINATION PREVENTION

MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPS...

Methods for manufacturing thermally enhanced flip-chip ball grid ar...