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Youngjoon KOH
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Suwon-si, KR
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last 30 patents
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Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
Publication number
20240321679
Publication date
Sep 26, 2024
Samsung Electronics Co., Ltd.
Youngjoon KOH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HEAT DISSIPATION STRUCTURES
Publication number
20240321682
Publication date
Sep 26, 2024
Samsung Electronics Co., Ltd.
Jonggyu Lee
H01 - BASIC ELECTRIC ELEMENTS