Youngnam Choi

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM USING HEAT SLUG
- Publication number 20070108596
- Publication date May 17, 2007
- STATS ChipPAC Ltd.
- Kyungsic Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME SUBSTRATE
- Publication number 20060102989
- Publication date May 18, 2006
- STATS ChipPAC Ltd.
- Cheonhee Lee
- H01 - BASIC ELECTRIC ELEMENTS