Youngseok Oh

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Actuation mechanisms for electrical interconnections
- Patent number 9,674,943
- Issue date Jun 6, 2017
- Intel Corporation
- Youngseok Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects including liquid metal
- Patent number 9,523,713
- Issue date Dec 20, 2016
- Intel Corporation
- Youngseok Oh
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ACTUATION MECHANISMS FOR ELECTRICAL INTERCONNECTIONS
- Publication number 20170273176
- Publication date Sep 21, 2017
- Intel Corporation
- Youngseok Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMED WIRE PROBE INTERCONNECT FOR TEST DIE CONTACTOR
- Publication number 20160178663
- Publication date Jun 23, 2016
- Intel Corporation
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECTS INCLUDING LIQUID METAL
- Publication number 20140354318
- Publication date Dec 4, 2014
- Youngseok Oh
- G01 - MEASURING TESTING
Information Patent Application
ACTUATION MECHANISMS FOR ELECTRICAL INTERCONNECTIONS
- Publication number 20140158416
- Publication date Jun 12, 2014
- Youngseok Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER APPARATUS AND METHODS
- Publication number 20140139247
- Publication date May 22, 2014
- Youngseok Oh
- G01 - MEASURING TESTING