Youngsuk Kim

Person

Ota-Ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser reflow apparatus and laser reflow method
- Patent number 11,935,863
- Issue date Mar 19, 2024
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,854,891
- Issue date Dec 26, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,115
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,114
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,756,831
- Issue date Sep 12, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece cutting method
- Patent number 11,682,569
- Issue date Jun 20, 2023
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus
- Patent number 11,607,771
- Issue date Mar 21, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing workpiece and resin sheet unit
- Patent number 11,590,629
- Issue date Feb 28, 2023
- Disco Corporation
- Yosuke Murata
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing workpiece and resin sheet unit
- Patent number 11,508,607
- Issue date Nov 22, 2022
- Disco Corporation
- Yosuke Murata
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of producing shielded individual semiconductor...
- Patent number 11,322,476
- Issue date May 3, 2022
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing method
- Patent number 11,289,348
- Issue date Mar 29, 2022
- Disco Corporation
- Byeongdeck Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate processing method and protective tape
- Patent number 11,183,464
- Issue date Nov 23, 2021
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and multilayer device chip manufacturing...
- Patent number 11,164,802
- Issue date Nov 2, 2021
- Disco Corporation
- Akihito Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing packaged device chip
- Patent number 11,133,198
- Issue date Sep 28, 2021
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plate-shaped workpiece processing method
- Patent number 11,114,385
- Issue date Sep 7, 2021
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 10,957,593
- Issue date Mar 23, 2021
- Disco Corporation
- Yoshiteru Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 10,957,542
- Issue date Mar 23, 2021
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method
- Patent number 10,937,668
- Issue date Mar 2, 2021
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for package substrate
- Patent number 10,861,716
- Issue date Dec 8, 2020
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 10,707,176
- Issue date Jul 7, 2020
- Disco Corporation
- Youngsuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 10,700,014
- Issue date Jun 30, 2020
- Disco Corporation
- Youngsuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assessing semiconductor substrate and method of assessing...
- Patent number 10,586,699
- Issue date Mar 10, 2020
- Disco Corporation
- Youngsuk Kim
- G01 - MEASURING TESTING
Information Patent Grant
Method for dividing substrate along division lines using abrasive m...
- Patent number 10,515,841
- Issue date Dec 24, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including a shield...
- Patent number 10,497,623
- Issue date Dec 3, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 10,431,555
- Issue date Oct 1, 2019
- Disco Corporation
- Byeongdeck Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-blade and processing method of workpiece
- Patent number 10,403,520
- Issue date Sep 3, 2019
- Disco Corporation
- Byeongdeck Jang
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,366,907
- Issue date Jul 30, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method
- Patent number 10,211,164
- Issue date Feb 19, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer processing method
- Patent number 8,765,579
- Issue date Jul 1, 2014
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIVIDING METHOD OF WAFER
- Publication number 20240071827
- Publication date Feb 29, 2024
- Disco Corporation
- Keiichiro NIITSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION METHOD
- Publication number 20230314234
- Publication date Oct 5, 2023
- Disco Corporation
- Teppei NOMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING SYSTEM
- Publication number 20230249283
- Publication date Aug 10, 2023
- Disco Corporation
- Keiichiro NIITSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE
- Publication number 20230090909
- Publication date Mar 23, 2023
- Disco Corporation
- Keiichiro NIITSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20220375742
- Publication date Nov 24, 2022
- Disco Corporation
- Youngsuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING LED DISPLAY PANEL
- Publication number 20220336715
- Publication date Oct 20, 2022
- Disco Corporation
- Zhiwen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE WELDING METHOD AND ELECTRODE WELDING APPARATUS
- Publication number 20220226934
- Publication date Jul 21, 2022
- Disco Corporation
- Yuki IKKU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157660
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157668
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157669
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157658
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157659
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157667
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER REFLOW APPARATUS AND LASER REFLOW METHOD
- Publication number 20210202431
- Publication date Jul 1, 2021
- Disco Corporation
- Satoshi KOBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING APPARATUS
- Publication number 20210154794
- Publication date May 27, 2021
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CUTTING METHOD
- Publication number 20210074559
- Publication date Mar 11, 2021
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND MULTILAYER DEVICE CHIP MANUFACTURING...
- Publication number 20200381315
- Publication date Dec 3, 2020
- Disco Corporation
- Akihito KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGED DEVICE CHIP
- Publication number 20200343108
- Publication date Oct 29, 2020
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT
- Publication number 20200180101
- Publication date Jun 11, 2020
- Disco Corporation
- Yosuke MURATA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT
- Publication number 20200185255
- Publication date Jun 11, 2020
- Disco Corporation
- Yosuke MURATA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20200176313
- Publication date Jun 4, 2020
- Disco Corporation
- Yoshiteru NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20200176257
- Publication date Jun 4, 2020
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20200161151
- Publication date May 21, 2020
- Disco Corporation
- Byeongdeck JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20200105715
- Publication date Apr 2, 2020
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE-SHAPED WORKPIECE PROCESSING METHOD
- Publication number 20190304927
- Publication date Oct 3, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20190295859
- Publication date Sep 26, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD FOR PACKAGE SUBSTRATE
- Publication number 20190279883
- Publication date Sep 12, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE PROCESSING METHOD AND PROTECTIVE TAPE
- Publication number 20190109094
- Publication date Apr 11, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSESSING SEMICONDUCTOR SUBSTRATE AND METHOD OF ASSESSING...
- Publication number 20190080905
- Publication date Mar 14, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BLADE AND PROCESSING METHOD OF WORKPIECE
- Publication number 20190067050
- Publication date Feb 28, 2019
- Disco Corporation
- Byeongdeck Jang
- B24 - GRINDING POLISHING

Youngsuk Kim

Person

Patents Grantslast 30 patents

Wafer manufacturing method and laminated device chip manufacturing...

Laser reflow apparatus and laser reflow method

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Workpiece cutting method

Wafer processing apparatus

Method of processing workpiece and resin sheet unit

Method of processing workpiece and resin sheet unit

Manufacturing method of producing shielded individual semiconductor...

Workpiece processing method

Package substrate processing method and protective tape

Wafer manufacturing method and multilayer device chip manufacturing...

Method of manufacturing packaged device chip

Plate-shaped workpiece processing method

Method of processing a wafer

Method of processing wafer

Semiconductor package manufacturing method

Processing method for package substrate

Method of manufacturing semiconductor package

Method of manufacturing semiconductor package

Method of assessing semiconductor substrate and method of assessing...

Method for dividing substrate along division lines using abrasive m...

Method of manufacturing a semiconductor package including a shield...

Method of manufacturing semiconductor package

Multi-blade and processing method of workpiece

Manufacturing method of semiconductor package

Semiconductor package manufacturing method

Semiconductor wafer processing method

Patents Applicationslast 30 patents

DIVIDING METHOD OF WAFER

INSPECTION METHOD

PROCESSING SYSTEM

PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE

PROCESSING METHOD OF WAFER

METHOD OF MANUFACTURING LED DISPLAY PANEL

ELECTRODE WELDING METHOD AND ELECTRODE WELDING APPARATUS

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

LASER REFLOW APPARATUS AND LASER REFLOW METHOD

WAFER PROCESSING APPARATUS

WORKPIECE CUTTING METHOD

WAFER MANUFACTURING METHOD AND MULTILAYER DEVICE CHIP MANUFACTURING...

METHOD OF MANUFACTURING PACKAGED DEVICE CHIP

METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT

METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT

METHOD OF PROCESSING A WAFER

METHOD OF PROCESSING WAFER

WORKPIECE PROCESSING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

PLATE-SHAPED WORKPIECE PROCESSING METHOD

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

PROCESSING METHOD FOR PACKAGE SUBSTRATE

PACKAGE SUBSTRATE PROCESSING METHOD AND PROTECTIVE TAPE

METHOD OF ASSESSING SEMICONDUCTOR SUBSTRATE AND METHOD OF ASSESSING...

MULTI-BLADE AND PROCESSING METHOD OF WORKPIECE