Youngsuk Nam

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Yongin-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material and semiconductor packages including the...
- Patent number 11,935,812
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...
- Publication number 20240186215
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
- Publication number 20240170366
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...
- Publication number 20220037227
- Publication date Feb 3, 2022
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS