Yousuke Moriyama

Person

Satsumasendai-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,004,293
- Issue date Jun 4, 2024
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 11,784,117
- Issue date Oct 10, 2023
- Kyocera Corporation
- Kazushi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 11,612,056
- Issue date Mar 21, 2023
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 11,570,882
- Issue date Jan 31, 2023
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 11,521,912
- Issue date Dec 6, 2022
- Kyocera Corporation
- Noboru Kitazumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate, electronic device, and ele...
- Patent number 11,145,587
- Issue date Oct 12, 2021
- Kyocera Corporation
- Yuuki Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 11,024,572
- Issue date Jun 1, 2021
- Kyocera Corporation
- Hidehisa Umino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 10,699,993
- Issue date Jun 30, 2020
- Kyocera Corporation
- Michio Imayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 10,319,672
- Issue date Jun 11, 2019
- Kyocera Corporation
- Michio Imayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 10,290,591
- Issue date May 14, 2019
- Kyocera Corporation
- Kensaku Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate, electronic device, and ele...
- Patent number 10,249,564
- Issue date Apr 2, 2019
- Kyocera Corporation
- Kensaku Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting board and electronic device
- Patent number 9,872,378
- Issue date Jan 16, 2018
- KYOCERA Corporation
- Shuya Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 9,848,491
- Issue date Dec 19, 2017
- Kyocera Corporation
- Nobuhiro Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device mounting board and electronic apparatus
- Patent number 9,826,641
- Issue date Nov 21, 2017
- KYOCERA Corporation
- Akihiko Funahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device mounting substrate, electronic apparatus, and ima...
- Patent number 9,609,743
- Issue date Mar 28, 2017
- Kyocera Corporation
- Akihiko Funahashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imaging element mounting substrate and imaging device
- Patent number 9,608,020
- Issue date Mar 28, 2017
- Kyocera Corporation
- Shinji Ichiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for mounting electronic element, electronic device, and ima...
- Patent number 9,609,754
- Issue date Mar 28, 2017
- KYOCERA Corporation
- Akihiko Funahashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring board
- Patent number 9,485,867
- Issue date Nov 1, 2016
- Kyocera Corporation
- Yurie Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup element housing package, and image pickup device
- Patent number 9,276,023
- Issue date Mar 1, 2016
- KYOCERA Corporation
- Hiroshi Yamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Many-up wiring substrate, wiring substrate, and electronic device
- Patent number 8,975,535
- Issue date Mar 10, 2015
- Kyocera Corporation
- Kazuhito Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, imaging device and imaging device module
- Patent number 8,659,105
- Issue date Feb 25, 2014
- Kyocera Corporation
- Fumiaki Takeshita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...
- Publication number 20230328885
- Publication date Oct 12, 2023
- Kyocera Corporation
- Yukio MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...
- Publication number 20230156904
- Publication date May 18, 2023
- Kyocera Corporation
- Yukio MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220148956
- Publication date May 12, 2022
- KYOCERA CORPORATION
- Kazushi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...
- Publication number 20210272868
- Publication date Sep 2, 2021
- KYOCERA CORPORATION
- Noboru KITAZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...
- Publication number 20210210408
- Publication date Jul 8, 2021
- KYOCERA CORPORATION
- Noboru KITAZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...
- Publication number 20210059047
- Publication date Feb 25, 2021
- KYOCERA CORPORATION
- Yukio MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...
- Publication number 20210007212
- Publication date Jan 7, 2021
- KYOCERA CORPORATION
- Yukio MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELE...
- Publication number 20200105658
- Publication date Apr 2, 2020
- KYOCERA CORPORATION
- Yuuki BABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20200075472
- Publication date Mar 5, 2020
- KYOCERA CORPORATION
- Hidehisa UMINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20190273036
- Publication date Sep 5, 2019
- Kyocera Corporation
- Michio IMAYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20180247898
- Publication date Aug 30, 2018
- KYOCERA CORPORATION
- Kensaku MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20180151483
- Publication date May 31, 2018
- KYOCERA CORPORATION
- Michio IMAYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELE...
- Publication number 20180061751
- Publication date Mar 1, 2018
- Kyocera Corporation
- Kensaku MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20170071058
- Publication date Mar 9, 2017
- KYOCERA CORPORATION
- Nobuhiro UEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGING ELEMENT MOUNTING SUBSTRATE AND IMAGING DEVICE
- Publication number 20160254302
- Publication date Sep 1, 2016
- KYOCERA CORPORATION
- Shinji ICHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MOUNTING SUBSTRATE, ELECTRONIC APPARATUS, AND IMA...
- Publication number 20160007447
- Publication date Jan 7, 2016
- KYOCERA, Corporation
- Akihiko FUNAHASHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC ELEMENT MOUNTING BOARD AND ELECTRONIC DEVICE
- Publication number 20150319846
- Publication date Nov 5, 2015
- KYOCERA CORPORATION
- Shuya KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND IMA...
- Publication number 20150305160
- Publication date Oct 22, 2015
- KYOCERA CORPORATION
- Akihiko FUNAHASHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE MOUNTING BOARD AND ELECTRONIC APPARATUS
- Publication number 20150124422
- Publication date May 7, 2015
- KYOCERA CORPORATION
- Akihiko Funahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE PICKUP ELEMENT HOUSING PACKAGE, AND IMAGE PICKUP DEVICE
- Publication number 20140346627
- Publication date Nov 27, 2014
- KYOCERA CORPORATION
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20140000940
- Publication date Jan 2, 2014
- KYOCERA CORPORATION
- Yurie Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANY-UP WIRING SUBSTRATE, WIRING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20120222895
- Publication date Sep 6, 2012
- Kyocera Corporation
- Kazuhito Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate, Imaging Device and Imaging Device Module
- Publication number 20120104524
- Publication date May 3, 2012
- KYOCERA CORPORATION
- Fumiaki Takeshita
- H01 - BASIC ELECTRIC ELEMENTS

Yousuke Moriyama

Person

Patents Grantslast 30 patents

Substrate for mounting electronic element, electronic device, and e...

Substrate for mounting electronic element, electronic device, and e...

Wiring board, electronic device, and electronic module

Substrate for mounting electronic element, electronic device, and e...

Substrate for mounting electronic element, electronic device, and e...

Electronic element mounting substrate, electronic device, and elect...

Electronic component mounting substrate, electronic device, and ele...

Wiring board, electronic device, and electronic module

Wiring board, electronic device, and electronic module

Wiring board, electronic device, and electronic module

Wiring board, electronic device, and electronic module

Electronic component mounting substrate, electronic device, and ele...

Electronic element mounting board and electronic device

Wiring board, electronic device, and electronic module

Electronic device mounting board and electronic apparatus

Electronic device mounting substrate, electronic apparatus, and ima...

Imaging element mounting substrate and imaging device

Package for mounting electronic element, electronic device, and ima...

Wiring board

Image pickup element housing package, and image pickup device

Many-up wiring substrate, wiring substrate, and electronic device

Wiring substrate, imaging device and imaging device module

Patents Applicationslast 30 patents

SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...

SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...

ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECT...

SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...

SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELE...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELE...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

IMAGING ELEMENT MOUNTING SUBSTRATE AND IMAGING DEVICE

ELECTRONIC DEVICE MOUNTING SUBSTRATE, ELECTRONIC APPARATUS, AND IMA...

ELECTRONIC ELEMENT MOUNTING BOARD AND ELECTRONIC DEVICE

PACKAGE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND IMA...

ELECTRONIC DEVICE MOUNTING BOARD AND ELECTRONIC APPARATUS

IMAGE PICKUP ELEMENT HOUSING PACKAGE, AND IMAGE PICKUP DEVICE

WIRING BOARD

MANY-UP WIRING SUBSTRATE, WIRING SUBSTRATE, AND ELECTRONIC DEVICE

Wiring Substrate, Imaging Device and Imaging Device Module