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Yousun Kim
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Santa Clara, CA, US
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last 30 patents
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Patent Grant
Method of reducing aluminum fluoride deposits in plasma etch reactor
Patent number
6,770,214
Issue date
Aug 3, 2004
Lam Research Corporation
Duane Outka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
Method of reducing aluminum fluoride deposits in plasma etch reactor
Publication number
20020179569
Publication date
Dec 5, 2002
Duane Outka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...