Youzhi E. Xu

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Underfill formulation and method of increasing an adhesion property...
- Patent number 8,354,467
- Issue date Jan 15, 2013
- Intel Corporation
- Linda A. Shekhawat
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Underfill formulation and method of increasing an adhesion property...
- Patent number 7,926,697
- Issue date Apr 19, 2011
- Intel Corporation
- Linda Shekhawat
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic assemblies with hot spot cooling and methods relating th...
- Patent number 7,704,798
- Issue date Apr 27, 2010
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with hot spot cooling
- Patent number 7,489,033
- Issue date Feb 10, 2009
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer through covalent bonding of thermal interface material
- Patent number 6,761,813
- Issue date Jul 13, 2004
- Intel Corporation
- Youzhi E. Xu
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY...
- Publication number 20110136941
- Publication date Jun 9, 2011
- Linda A. Shekhawat
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL
- Publication number 20090170247
- Publication date Jul 2, 2009
- Linda A. SHEKHAWAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH HOT SPOT COOLING AND METHODS RELATING TH...
- Publication number 20090093072
- Publication date Apr 9, 2009
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY...
- Publication number 20090076220
- Publication date Mar 19, 2009
- Linda A. Shekhawat
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC ASSEMBLY WITH HOT SPOT COOLING
- Publication number 20080111234
- Publication date May 15, 2008
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS