Yu-Chen Chuo

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New Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Embedded electronic device package structure
- Patent number 8,803,310
- Issue date Aug 12, 2014
- Unimicron Technology Corp.
- Yu-Chen Chuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded electronic device package structure
- Patent number 8,736,033
- Issue date May 27, 2014
- Unimicron Technology Corp.
- Yu-Chen Chuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED ELECTRONIC DEVICE PACKAGE STRUCTURE
- Publication number 20140225272
- Publication date Aug 14, 2014
- Unimicron Technology Corp.
- Yu-Chen Chuo
- H01 - BASIC ELECTRIC ELEMENTS