Membership
Tour
Register
Log in
Yu-Cheng CHIAO
Follow
Person
Taichung City, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Stacked electronic device and method for fabricating the same
Patent number
10,483,235
Issue date
Nov 19, 2019
Winbond Electronics Corp.
Yu-Cheng Chiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked package device and method for fabricating the same
Patent number
9,881,901
Issue date
Jan 30, 2018
Winbond Electronics Corp.
Yu-Cheng Chiao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED PACKAGE DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20160329305
Publication date
Nov 10, 2016
WINBOND ELECTRONICS CORP.
Yu-Cheng CHIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Electronic Device and Method for Fabricating the Same
Publication number
20160329244
Publication date
Nov 10, 2016
WINBOND ELECTRONICS CORP.
Yu-Cheng CHIAO
H01 - BASIC ELECTRIC ELEMENTS