Yu-Chih Chen

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Stacked multi-chip package with EMI shielding
- Patent number 7,514,774
- Issue date Apr 7, 2009
- Hong Kong Applied Science Technology Research Institute Company Limited
- Lap Wai Leung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked multi-chip package with EMI shielding
- Publication number 20080067656
- Publication date Mar 20, 2008
- Hong Kong Applied Science
- Lap Wai Leung
- H01 - BASIC ELECTRIC ELEMENTS