Yu-Chih Yu

Follow

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,165,789
- Issue date Oct 20, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging substrate, and fabrication method o...
- Patent number 9,006,039
- Issue date Apr 14, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor package
- Patent number 8,810,045
- Issue date Aug 19, 2014
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20150187603
- Publication date Jul 2, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE, AND FABRICATION METHOD O...
- Publication number 20140315353
- Publication date Oct 23, 2014
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD T...
- Publication number 20130334694
- Publication date Dec 19, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS