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Yu-Ching Liu
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Taichung Hsien, TW
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Patents Grants
last 30 patents
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Patent Grant
Fabrication method of packaging substrate
Patent number
9,269,677
Issue date
Feb 23, 2016
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, packaging substrate and fabrication method t...
Patent number
8,901,729
Issue date
Dec 2, 2014
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
Publication number
20150050782
Publication date
Feb 19, 2015
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE AND FABRICATION METHOD T...
Publication number
20130161837
Publication date
Jun 27, 2013
Siliconware Precision Industries Co., Ltd.
Chia-Yin Chen
H01 - BASIC ELECTRIC ELEMENTS