Yu-Fei Huang

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Pleasanton, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-via interconnect structure and method of manufacture
- Patent number 9,425,150
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-VIA INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20150228584
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS