Yu Fu CHEUNG

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
High precision bonding apparatus comprising heater
- Patent number 11,552,031
- Issue date Jan 10, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH PRECISION BONDING APPARATUS COMPRISING HEATER
- Publication number 20210288004
- Publication date Sep 16, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION
- Publication number 20210225800
- Publication date Jul 22, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung WAN
- H01 - BASIC ELECTRIC ELEMENTS