Yu Gong

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Stator assembly and stator for motor
- Patent number 11,936,263
- Issue date Mar 19, 2024
- Schaeffler Technologies AG & Co. KG
- Yu Gong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and terminal for determining frequency to be measured
- Patent number 10,506,462
- Issue date Dec 10, 2019
- Huawei Technologies Co., Ltd.
- Yanyan Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and terminal for determining frequency to be measured
- Patent number 9,781,617
- Issue date Oct 3, 2017
- Huawei Technologies Co., Ltd.
- Yanyan Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Hot rolled silicon steel producing method
- Patent number 9,496,078
- Issue date Nov 15, 2016
- Baoshan Iron & Steel Co., Ltd.
- Huawei Zhang
- C21 - METALLURGY OF IRON
Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,245,861
- Issue date Jan 26, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STATOR ASSEMBLY AND STATOR FOR MOTOR
- Publication number 20220255388
- Publication date Aug 11, 2022
- SCHAEFFLER TECHNOLOGIES AG & CO. KG
- Yu Gong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD AND TERMINAL FOR DETERMINING FREQUENCY TO BE MEASURED
- Publication number 20170359744
- Publication date Dec 14, 2017
- Huawei Technologies Co., Ltd
- Yanyan CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Hot Rolled Silicon Steel Producing Method
- Publication number 20150243418
- Publication date Aug 27, 2015
- Baoshan Iron & Steel Co., Ltd
- Huawei Zhang
- C21 - METALLURGY OF IRON
Information Patent Application
METHOD AND TERMINAL FOR DETERMINING FREQUENCY TO BE MEASURED
- Publication number 20150063156
- Publication date Mar 5, 2015
- Huawei Technologies Co., Ltd
- Yanyan CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20140315350
- Publication date Oct 23, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS