Yu-Juan Chan

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,211,740
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Belt sander
- Patent number 12,115,618
- Issue date Oct 15, 2024
- Basso Industry Corp.
- Yu-Da Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Graphene-assisted low-resistance interconnect structures and method...
- Patent number 12,113,021
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,068,254
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with two-dimensional conductive structures
- Patent number 12,068,253
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two 2D capping layers on interconnect conductive structure to incre...
- Patent number 12,051,645
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with reduced capacitances
- Patent number 12,046,506
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including liner structure
- Patent number 12,027,419
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods of forming the same
- Patent number 12,002,710
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vertical conductive graphene and met...
- Patent number 11,948,837
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection liner on interconnect wire to enlarge processing window...
- Patent number 11,908,794
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-assisted low-resistance interconnect structures and method...
- Patent number 11,710,700
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,670,595
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnection structure including conductive g...
- Patent number 11,640,940
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two 2D capping layers on interconnect conductive structure to incre...
- Patent number 11,532,549
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection liner on interconnect wire to enlarge processing window...
- Patent number 11,309,241
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-assisted low-resistance interconnect structures and method...
- Patent number 11,081,447
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnection structure
- Patent number 11,011,467
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and method for forming the same
- Patent number 10,741,493
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and method for forming the same
- Patent number 10,141,260
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of forming same
- Patent number 9,231,048
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Di An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of forming same
- Patent number 8,497,540
- Issue date Jul 30, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Di An
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE INCLUDING CONDUCTIVE FEATURE WITH LOW CONTAC...
- Publication number 20250079314
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hans HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...
- Publication number 20250054810
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC POWER TOOL
- Publication number 20240413714
- Publication date Dec 12, 2024
- BASSO INDUSTRY CORP.
- Yu-Ming CHAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387251
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240387269
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...
- Publication number 20240379559
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379558
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363538
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20240321632
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE
- Publication number 20240282697
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20240203789
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20240145381
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...
- Publication number 20240071822
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230378067
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsu-Chun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...
- Publication number 20230369225
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...
- Publication number 20230335497
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230275027
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230268274
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230064444
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230066891
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsu-Chun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230062128
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230037554
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BELT SANDER
- Publication number 20220362901
- Publication date Nov 17, 2022
- BASSO INDUSTRY CORP.
- Yu-Da CHEN
- B24 - GRINDING POLISHING
Information Patent Application
TWO 2D CAPPING LAYERS ON INTERCONNECT CONDUCTIVE STRUCTURE TO INCRE...
- Publication number 20220359381
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220359414
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Reduced Capacitances
- Publication number 20220359263
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220270970
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20220238434
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS

Yu-Juan Chan

Person

Patents Grantslast 30 patents

Interconnect structure and methods of forming the same

Belt sander

Graphene-assisted low-resistance interconnect structures and method...

Interconnection structure and methods of forming the same

Semiconductor structure with two-dimensional conductive structures

Two 2D capping layers on interconnect conductive structure to incre...

Devices with reduced capacitances

Semiconductor device including liner structure

Semiconductor structure and methods of forming the same

Semiconductor structure having vertical conductive graphene and met...

Protection liner on interconnect wire to enlarge processing window...

Graphene-assisted low-resistance interconnect structures and method...

Semiconductor device structure and methods of forming the same

Methods of forming interconnection structure including conductive g...

Two 2D capping layers on interconnect conductive structure to incre...

Protection liner on interconnect wire to enlarge processing window...

Graphene-assisted low-resistance interconnect structures and method...

Method of forming interconnection structure

Interconnection structure and method for forming the same

Interconnection structure and method for forming the same

Capacitor and method of forming same

Capacitor and method of forming same

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE INCLUDING CONDUCTIVE FEATURE WITH LOW CONTAC...

SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...

ELECTRIC POWER TOOL

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME

GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...

DEVICES WITH REDUCED CAPACITANCES

SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...

GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND MET...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

BELT SANDER

TWO 2D CAPPING LAYERS ON INTERCONNECT CONDUCTIVE STRUCTURE TO INCRE...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

Devices with Reduced Capacitances

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...