Yu-Li Chung

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Kaoshiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Thermal dissipation device and semiconductor package device includi...
- Patent number 10,074,586
- Issue date Sep 11, 2018
- Advanced Semiconductor Engineering, Inc.
- Pin Hung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package of leadframe with heatsinks
- Patent number 7,365,422
- Issue date Apr 29, 2008
- Advanced Semiconductor Engineering, Inc.
- Pai-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL DISSIPATION DEVICE AND SEMICONDUCTOR PACKAGE DEVICE INCLUDI...
- Publication number 20180138105
- Publication date May 17, 2018
- Advanced Semiconductor Engineering, Inc.
- Pin Hung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package of leadframe with heatsinks
- Publication number 20070069345
- Publication date Mar 29, 2007
- Pai-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS