Yu-Lung Chin

Follow

Person

Tainan Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a semiconductor device having improved hot c...
- Patent number 7,250,332
- Issue date Jul 31, 2007
- United Microelectronics Corp.
- Wen-Koi Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE HAVING IMPROVED HOT C...
- Publication number 20060040448
- Publication date Feb 23, 2006
- Wen-Koi Lai
- H01 - BASIC ELECTRIC ELEMENTS