Yu Ping Gu

Follow

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for measuring a thickness of a layer of a wafer
- Patent number 7,777,483
- Issue date Aug 17, 2010
- Applied Materials, Inc.
- Lawrence C. Lei
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method of dynamically measuring thickness of a layer...
- Patent number 7,355,394
- Issue date Apr 8, 2008
- Applied Materials, Inc.
- Lawrence C. Lei
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for dynamically measuring the thickness of an...
- Patent number 7,112,961
- Issue date Sep 26, 2006
- Applied Materials, Inc.
- Lawrence C. Lei
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR MEASURING OBJECT THICKNESS
- Publication number 20080186022
- Publication date Aug 7, 2008
- Applied Materials, Inc., a Delaware corporation
- Lawrence C. Lei
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for measuring object thickness
- Publication number 20070063698
- Publication date Mar 22, 2007
- Applied Materials, Inc.
- Lawrence C. Lei
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for measuring object thickness
- Publication number 20040140797
- Publication date Jul 22, 2004
- APPLIED MATERIALS, INC.
- Lawrence C. Lei
- G01 - MEASURING TESTING