Yu-Sheng LAI

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging lens, camera module and electronic device
- Patent number 12,216,396
- Issue date Feb 4, 2025
- LARGAN PRECISION CO., LTD
- Hao Jan Chen
- G02 - OPTICS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN reliability built-in self test (BIST) apparatus and method for...
- Patent number 12,163,995
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ann Lai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetoresistive random access memory and method of manufacturing t...
- Patent number 12,133,474
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Hui-Lin Wang
Information Patent Grant
Wireless power-charging module
- Patent number 12,119,168
- Issue date Oct 15, 2024
- Delta Electronics, Inc.
- Yu-Chun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging lens assembly, image capturing apparatus and electronic device
- Patent number 12,111,484
- Issue date Oct 8, 2024
- LARGAN PRECISION CO., LTD
- Chih-Wei Cheng
- G02 - OPTICS
Information Patent Grant
Light pass aperture module, camera module and electronic device
- Patent number 12,105,410
- Issue date Oct 1, 2024
- LARGAN PRECISION CO., LTD
- Hao Jan Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric haptic structure
- Patent number 12,089,500
- Issue date Sep 10, 2024
- DARWIN PRECISIONS CORPORATION
- Yu-Jen Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Processing system and method for updating firmware online
- Patent number 12,079,613
- Issue date Sep 3, 2024
- ECOLUX TECHNOLOGY CO., LTD.
- Yu-Cheng Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lens driving module, photographing camera and electronic device
- Patent number 12,066,691
- Issue date Aug 20, 2024
- LARGAN DIGITAL CO., LTD.
- Hao Jan Chen
- G02 - OPTICS
Information Patent Grant
Mass transfer equipment
- Patent number 12,057,330
- Issue date Aug 6, 2024
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for power supply input power management
- Patent number 12,055,992
- Issue date Aug 6, 2024
- Dell Products L.P.
- Yu-Hung Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packages with thick RDLs and thin RDLs stacked alternatingly
- Patent number 12,057,405
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 12,014,976
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging lens system, image capturing unit and electronic device
- Patent number 12,007,619
- Issue date Jun 11, 2024
- LARGAN PRECISION CO., LTD
- Yu Chen Lai
- G02 - OPTICS
Information Patent Grant
Imaging lens system, image capturing unit and electronic device
- Patent number 12,007,617
- Issue date Jun 11, 2024
- LARGAN PRECISION CO., LTD
- Yu Chen Lai
- G02 - OPTICS
Information Patent Grant
Imaging lens system, image capturing module and electronic device
- Patent number 12,007,589
- Issue date Jun 11, 2024
- LARGAN PRECISION CO., LTD
- Chun-Hua Tsai
- G02 - OPTICS
Information Patent Grant
Imaging lens assembly, image capturing device and electronic device
- Patent number 11,994,736
- Issue date May 28, 2024
- LARGAN PRECISION CO., LTD
- Yu-Chen Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit packages having support rings
- Patent number 11,990,381
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packet sorting and reassembly circuit module
- Patent number 11,979,479
- Issue date May 7, 2024
- Chung Yuan Christian University
- Yu-Kuen Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imaging lens assembly, imaging apparatus and electronic device
- Patent number 11,971,601
- Issue date Apr 30, 2024
- LARGAN PRECISION CO., LTD
- Yu-Chen Lai
- G02 - OPTICS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, non-contact key, and input device
- Patent number 11,928,882
- Issue date Mar 12, 2024
- DARWIN PRECISIONS CORPORATION
- Yu Jen Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Controllable aperture stop, compact camera module and electronic de...
- Patent number 11,921,417
- Issue date Mar 5, 2024
- LARGAN PRECISION CO., LTD
- Hao Jan Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Lens assembly, optical unit and electronic device
- Patent number 11,924,534
- Issue date Mar 5, 2024
- LARGAN PRECISION CO., LTD
- Jyun-Jia Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Via-first self-aligned interconnect formation process
- Patent number 11,908,731
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Tse Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actuator, image capturing unit and electronic device
- Patent number 11,895,402
- Issue date Feb 6, 2024
- LARGAN DIGITAL CO., LTD.
- Yu Chen Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
GAN RELIABILITY BUILT-IN SELF TEST (BIST) APPARATUS AND METHOD FOR...
- Publication number 20250060404
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Ann LAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20250014961
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS POWER-CHARGING MODULE AND METHOD FOR ASSEMBLING THAT SAME
- Publication number 20250014810
- Publication date Jan 9, 2025
- Delta Electronics, Inc.
- Cheng-Lin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LENS ELEMENT, HYBRID LENS ELEMENT, IMAGING LENS ASSEMBLY, IMA...
- Publication number 20250004240
- Publication date Jan 2, 2025
- LARGAN PRECISION CO., LTD.
- Hsuan-Chin HUANG
- G02 - OPTICS
Information Patent Application
CONTROLLABLE APERTURE STOP, COMPACT CAMERA MODULE AND ELECTRONIC DE...
- Publication number 20240411206
- Publication date Dec 12, 2024
- LARGAN PRECISION CO., LTD.
- Hao Jan CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...
- Publication number 20240404993
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT PASS APERTURE MODULE, CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20240402574
- Publication date Dec 5, 2024
- LARGAN PRECISION CO., LTD.
- Hao Jan CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240393690
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Tse Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395701
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
- Publication number 20240395750
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Shen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240395549
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SCHOTTKY BARRIER INTERFACE AND MANUFACTUR...
- Publication number 20240379842
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-YING LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING LENS SYSTEM, IMAGE CAPTURING MODULE AND ELECTRONIC DEVICE
- Publication number 20240377560
- Publication date Nov 14, 2024
- LARGAN PRECISION CO., LTD.
- Chun-Tang TSAI
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS DRIVING MODULE, PHOTOGRAPHING CAMERA AND ELECTRONIC DEVICE
- Publication number 20240369806
- Publication date Nov 7, 2024
- LARGAN DIGITAL CO.,LTD.
- Hao Jan CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CMOS DATA CLEARING CIRCUIT
- Publication number 20240364332
- Publication date Oct 31, 2024
- ASRock Industrial Computer Corporation
- Yu-Lin Lai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
- Publication number 20240355754
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS
- Publication number 20240339446
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ying Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Methods of Forming the Same
- Publication number 20240304535
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING LENS, CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20240295681
- Publication date Sep 5, 2024
- LARGAN PRECISION CO., LTD.
- Yu Chen LAI
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20240290703
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR STRUCTURE AND MANUFACTURING METHO...
- Publication number 20240282798
- Publication date Aug 22, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yu Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID WITH A VAPOR CHAMBER BASE HAVING AN ANGLED PORTION AND...
- Publication number 20240274504
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM TO INTRODUCE BRIGHT FIELD IMAGING AT STITCHING AR...
- Publication number 20240248387
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Min WANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKET SORTING AND REASSEMBLY CIRCUIT MODULE
- Publication number 20240236212
- Publication date Jul 11, 2024
- Chung Yuan Christian University
- Yu-Kuen Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGING LENS ASSEMBLY, IMAGING APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240231033
- Publication date Jul 11, 2024
- LARGAN PRECISION CO., LTD.
- Yu-Chen LAI
- G02 - OPTICS
Information Patent Application
WIRELESS POWER-CHARGING MODULE
- Publication number 20240234027
- Publication date Jul 11, 2024
- Delta Electronics, Inc.
- Yu-Chun LAI
- H01 - BASIC ELECTRIC ELEMENTS

Yu-Sheng LAI

Person

Patents Grantslast 30 patents

Method of manufacturing a via and a metal wiring for a semiconducto...

Imaging lens, camera module and electronic device

Semiconductor device, circuit board structure and manufacturing met...

GaN reliability built-in self test (BIST) apparatus and method for...

Semiconductor package and manufacturing method of semiconductor pac...

Magnetoresistive random access memory and method of manufacturing t...

Wireless power-charging module

Imaging lens assembly, image capturing apparatus and electronic device

Light pass aperture module, camera module and electronic device

Package structure with conductive patterns in a redistribution layer

Piezoelectric haptic structure

Processing system and method for updating firmware online

Lens driving module, photographing camera and electronic device

Mass transfer equipment

System and method for power supply input power management

Packages with thick RDLs and thin RDLs stacked alternatingly

Chip package structure including a silicon substrate interposer and...

Imaging lens system, image capturing unit and electronic device

Imaging lens system, image capturing unit and electronic device

Imaging lens system, image capturing module and electronic device

Imaging lens assembly, image capturing device and electronic device

Integrated circuit packages having support rings

Packet sorting and reassembly circuit module

Imaging lens assembly, imaging apparatus and electronic device

Semiconductor structure and method of forming the same

Display device, non-contact key, and input device

Controllable aperture stop, compact camera module and electronic de...

Lens assembly, optical unit and electronic device

Via-first self-aligned interconnect formation process

Actuator, image capturing unit and electronic device

Patents Applicationslast 30 patents

GAN RELIABILITY BUILT-IN SELF TEST (BIST) APPARATUS AND METHOD FOR...

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...

WIRELESS POWER-CHARGING MODULE AND METHOD FOR ASSEMBLING THAT SAME

GLASS LENS ELEMENT, HYBRID LENS ELEMENT, IMAGING LENS ASSEMBLY, IMA...

CONTROLLABLE APERTURE STOP, COMPACT CAMERA MODULE AND ELECTRONIC DE...

SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

LIGHT PASS APERTURE MODULE, CAMERA MODULE AND ELECTRONIC DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

SEMICONDUCTOR DEVICE WITH SCHOTTKY BARRIER INTERFACE AND MANUFACTUR...

IMAGING LENS SYSTEM, IMAGE CAPTURING MODULE AND ELECTRONIC DEVICE

PACKAGE STRUCTURE

Integrated Circuit Package and Method

LENS DRIVING MODULE, PHOTOGRAPHING CAMERA AND ELECTRONIC DEVICE

CMOS DATA CLEARING CIRCUIT

PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY

EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS

Integrated Circuit Package and Methods of Forming the Same

IMAGING LENS, CAMERA MODULE AND ELECTRONIC DEVICE

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

BACKSIDE ILLUMINATED IMAGE SENSOR STRUCTURE AND MANUFACTURING METHO...

PACKAGE LID WITH A VAPOR CHAMBER BASE HAVING AN ANGLED PORTION AND...

METHOD AND SYSTEM TO INTRODUCE BRIGHT FIELD IMAGING AT STITCHING AR...

PACKET SORTING AND REASSEMBLY CIRCUIT MODULE

IMAGING LENS ASSEMBLY, IMAGING APPARATUS AND ELECTRONIC DEVICE

WIRELESS POWER-CHARGING MODULE