Yu-Sheng LAI

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display device
- Patent number 12,364,057
- Issue date Jul 15, 2025
- PlayNitride Display Co., Ltd.
- Yu-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,349,367
- Issue date Jul 1, 2025
- United Microelectronics Corp.
- Chih-Wei Kuo
Information Patent Grant
Touch light-emitting decoration nameplate
- Patent number 12,341,144
- Issue date Jun 24, 2025
- DARWIN PRECISIONS CORPORATION
- Hsuan Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controllable aperture stop, compact camera module and electronic de...
- Patent number 12,287,564
- Issue date Apr 29, 2025
- LARGAN PRECISION CO., LTD
- Hao Jan Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of fabricating semiconductor structure including a barrier s...
- Patent number 12,278,208
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controllable aperture stop, compact camera module and electronic de...
- Patent number 12,276,904
- Issue date Apr 15, 2025
- LARGAN PRECISION CO., LTD
- Hao Jan Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,265,332
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Tse Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with movable foot pad
- Patent number 12,242,307
- Issue date Mar 4, 2025
- Compal Electronics, Inc.
- I-Hsuan Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging lens, camera module and electronic device
- Patent number 12,216,396
- Issue date Feb 4, 2025
- LARGAN PRECISION CO., LTD
- Hao Jan Chen
- G02 - OPTICS
Information Patent Grant
Optical element driving unit, imaging optical module and electronic...
- Patent number 12,210,206
- Issue date Jan 28, 2025
- LARGAN DIGITAL CO., LTD.
- Yu Chen Lai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for measuring muscle mass
- Patent number 12,207,962
- Issue date Jan 28, 2025
- National Cheng Kung University
- Yi-Shan Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN reliability built-in self test (BIST) apparatus and method for...
- Patent number 12,163,995
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ann Lai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Magnetoresistive random access memory and method of manufacturing t...
- Patent number 12,133,474
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Hui-Lin Wang
Information Patent Grant
Wireless power-charging module
- Patent number 12,119,168
- Issue date Oct 15, 2024
- Delta Electronics, Inc.
- Yu-Chun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging lens assembly, image capturing apparatus and electronic device
- Patent number 12,111,484
- Issue date Oct 8, 2024
- LARGAN PRECISION CO., LTD
- Chih-Wei Cheng
- G02 - OPTICS
Information Patent Grant
Light pass aperture module, camera module and electronic device
- Patent number 12,105,410
- Issue date Oct 1, 2024
- LARGAN PRECISION CO., LTD
- Hao Jan Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric haptic structure
- Patent number 12,089,500
- Issue date Sep 10, 2024
- DARWIN PRECISIONS CORPORATION
- Yu-Jen Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Processing system and method for updating firmware online
- Patent number 12,079,613
- Issue date Sep 3, 2024
- ECOLUX TECHNOLOGY CO., LTD.
- Yu-Cheng Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lens driving module, photographing camera and electronic device
- Patent number 12,066,691
- Issue date Aug 20, 2024
- LARGAN DIGITAL CO., LTD.
- Hao Jan Chen
- G02 - OPTICS
Information Patent Grant
Mass transfer equipment
- Patent number 12,057,330
- Issue date Aug 6, 2024
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thick RDLs and thin RDLs stacked alternatingly
- Patent number 12,057,405
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for power supply input power management
- Patent number 12,055,992
- Issue date Aug 6, 2024
- Dell Products L.P.
- Yu-Hung Lai
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...
- Publication number 20250239490
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICRO DEVICE PANEL
- Publication number 20250239470
- Publication date Jul 24, 2025
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING BODY COMPOSITION AND SYSTEM FOR USING THEREOF
- Publication number 20250213187
- Publication date Jul 3, 2025
- National Cheng Kung University
- Pei-Fang SU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20250199408
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Tse LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND MET...
- Publication number 20250194143
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-YING LAI
Information Patent Application
IMAGE SENSOR MODULE, CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20250189695
- Publication date Jun 12, 2025
- LARGAN INDUSTRIAL OPTICS CO., LTD.
- Tzu-Kan CHEN
- G02 - OPTICS
Information Patent Application
ENERGY-SAVING ASSEMBLY FOR INDIRECT HEATING SYSTEMS
- Publication number 20250172290
- Publication date May 29, 2025
- Industrial Technology Research Institute
- Yi-Hsing Lin
- F23 - COMBUSTION APPARATUS COMBUSTION PROCESSES
Information Patent Application
CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20250130479
- Publication date Apr 24, 2025
- LARGAN PRECISION CO., LTD.
- Hao Jan CHEN
- G02 - OPTICS
Information Patent Application
BOX FOLDING MACHINE
- Publication number 20250121576
- Publication date Apr 17, 2025
- EXPACK INDUSTRIAL CORPORATION
- Yu-Ting LAI
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Application
OPTICAL ELEMENT DRIVING UNIT, IMAGING OPTICAL MODULE AND ELECTRONIC...
- Publication number 20250123460
- Publication date Apr 17, 2025
- LARGAN DIGITAL CO.,LTD.
- Yu Chen LAI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC ELEMENT ASSEMBLY, IMAGE SENSOR MODULE, CAMERA MODULE AND...
- Publication number 20250120011
- Publication date Apr 10, 2025
- LARGAN INDUSTRIAL OPTICS CO., LTD.
- Ti Lun LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250105084
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE, CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20250093745
- Publication date Mar 20, 2025
- LARGAN INDUSTRIAL OPTICS CO., LTD.
- Tzu-Kan CHEN
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...
- Publication number 20250096198
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250087633
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...
- Publication number 20250079346
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ting Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN RELIABILITY BUILT-IN SELF TEST (BIST) APPARATUS AND METHOD FOR...
- Publication number 20250060404
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Ann LAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MEDICAL IMAGE-BASED SYSTEM FOR PREDICTING LESION CLASSIFICATION, AN...
- Publication number 20250037858
- Publication date Jan 30, 2025
- National Cheng Kung University
- YI-SHAN TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20250014961
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS POWER-CHARGING MODULE AND METHOD FOR ASSEMBLING THAT SAME
- Publication number 20250014810
- Publication date Jan 9, 2025
- Delta Electronics, Inc.
- Cheng-Lin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LENS ELEMENT, HYBRID LENS ELEMENT, IMAGING LENS ASSEMBLY, IMA...
- Publication number 20250004240
- Publication date Jan 2, 2025
- LARGAN PRECISION CO., LTD.
- Hsuan-Chin HUANG
- G02 - OPTICS
Information Patent Application
CONTROLLABLE APERTURE STOP, COMPACT CAMERA MODULE AND ELECTRONIC DE...
- Publication number 20240411206
- Publication date Dec 12, 2024
- LARGAN PRECISION CO., LTD.
- Hao Jan CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...
- Publication number 20240404993
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT PASS APERTURE MODULE, CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20240402574
- Publication date Dec 5, 2024
- LARGAN PRECISION CO., LTD.
- Hao Jan CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240393690
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Tse Lai
- H01 - BASIC ELECTRIC ELEMENTS

Yu-Sheng LAI

Person

Patents Grantslast 30 patents

IPD modules with flexible connection scheme in packaging

Micro LED display device

Semiconductor device and method for fabricating the same

Touch light-emitting decoration nameplate

Semiconductor device having a heat dissipation structure connected...

Integrated circuit package and method

Controllable aperture stop, compact camera module and electronic de...

Method of fabricating semiconductor structure including a barrier s...

Controllable aperture stop, compact camera module and electronic de...

Conductive bump of a semiconductor device and fabricating method th...

Method of manufacturing a semiconductor device

Electronic device with movable foot pad

Method of manufacturing a via and a metal wiring for a semiconducto...

Imaging lens, camera module and electronic device

Optical element driving unit, imaging optical module and electronic...

Method for measuring muscle mass

Semiconductor device, circuit board structure and manufacturing met...

Semiconductor package and manufacturing method of semiconductor pac...

GaN reliability built-in self test (BIST) apparatus and method for...

Magnetoresistive random access memory and method of manufacturing t...

Wireless power-charging module

Imaging lens assembly, image capturing apparatus and electronic device

Light pass aperture module, camera module and electronic device

Package structure with conductive patterns in a redistribution layer

Piezoelectric haptic structure

Processing system and method for updating firmware online

Lens driving module, photographing camera and electronic device

Mass transfer equipment

Packages with thick RDLs and thin RDLs stacked alternatingly

System and method for power supply input power management

Patents Applicationslast 30 patents

DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

METHOD OF FABRICATING MICRO DEVICE PANEL

SEMICONDUCTOR STRUCTURE

METHOD FOR EVALUATING BODY COMPOSITION AND SYSTEM FOR USING THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND MET...

IMAGE SENSOR MODULE, CAMERA MODULE AND ELECTRONIC DEVICE

ENERGY-SAVING ASSEMBLY FOR INDIRECT HEATING SYSTEMS

CAMERA MODULE AND ELECTRONIC DEVICE

BOX FOLDING MACHINE

OPTICAL ELEMENT DRIVING UNIT, IMAGING OPTICAL MODULE AND ELECTRONIC...

ELECTRONIC ELEMENT ASSEMBLY, IMAGE SENSOR MODULE, CAMERA MODULE AND...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

IMAGE SENSOR MODULE, CAMERA MODULE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...

GAN RELIABILITY BUILT-IN SELF TEST (BIST) APPARATUS AND METHOD FOR...

MEDICAL IMAGE-BASED SYSTEM FOR PREDICTING LESION CLASSIFICATION, AN...

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...

WIRELESS POWER-CHARGING MODULE AND METHOD FOR ASSEMBLING THAT SAME

GLASS LENS ELEMENT, HYBRID LENS ELEMENT, IMAGING LENS ASSEMBLY, IMA...

CONTROLLABLE APERTURE STOP, COMPACT CAMERA MODULE AND ELECTRONIC DE...

SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

LIGHT PASS APERTURE MODULE, CAMERA MODULE AND ELECTRONIC DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE