Yuan-Feng CHIANG

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and the method of manufacturing the same
- Patent number 12,107,056
- Issue date Oct 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,837,557
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Peng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 11,791,227
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Kuoching Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 11,521,958
- Issue date Dec 6, 2022
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,189,576
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Peng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,037,853
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,344,383
- Issue date Jul 9, 2019
- Advanced Semiconductor Engineering, Inc.
- Chuan-Yung Shih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interposer and semiconductor package device
- Patent number 10,325,854
- Issue date Jun 18, 2019
- Advanced Semiconductor Engineering, Inc.
- Kun-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a protection layer
- Patent number 10,211,161
- Issue date Feb 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Yuan-Feng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, interposer and semiconductor process for man...
- Patent number 9,947,635
- Issue date Apr 17, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 9,929,078
- Issue date Mar 27, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250029940
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413115
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ling YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE PILLARS AND REINFORCIN...
- Publication number 20230094668
- Publication date Mar 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220367304
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Kuoching CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220084958
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20210225783
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210183723
- Publication date Jun 17, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20210134781
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190040527
- Publication date Feb 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Chuan-Yung SHIH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interconnection Structure and Semiconductor Package Device
- Publication number 20190027441
- Publication date Jan 24, 2019
- Advanced Semiconductor Engineering, Inc.
- Kun-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD F...
- Publication number 20180342473
- Publication date Nov 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, INTERPOSER AND SEMICONDUCTOR PROCESS FOR MAN...
- Publication number 20180108634
- Publication date Apr 19, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180061767
- Publication date Mar 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Yuan-Feng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180061776
- Publication date Mar 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170207151
- Publication date Jul 20, 2017
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS

Yuan-Feng CHIANG

Person

Patents Grantslast 30 patents

Semiconductor device package and the method of manufacturing the same

Semiconductor device package and a method of manufacturing the same

Electronic device package

Semiconductor device package with conductive pillars and reinforcin...

Semiconductor device package and a method of manufacturing the same

Semiconductor package structure and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Interposer and semiconductor package device

Semiconductor package structure having a protection layer

Semiconductor package, interposer and semiconductor process for man...

Semiconductor package structure and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE PILLARS AND REINFORCIN...

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Interconnection Structure and Semiconductor Package Device

VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD F...

SEMICONDUCTOR PACKAGE, INTERPOSER AND SEMICONDUCTOR PROCESS FOR MAN...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME