Yuan-Fu Lan

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method and a related stackable chip package
- Patent number 11,024,603
- Issue date Jun 1, 2021
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure with encapsulation and redistribution lay...
- Patent number 10,892,250
- Issue date Jan 12, 2021
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package including exterior conductive element and a manufac...
- Patent number 10,354,978
- Issue date Jul 16, 2019
- POWERTECH TECHNOLOGY INC.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process method including disposing a die within a recess of...
- Patent number 10,224,254
- Issue date Mar 5, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate
- Patent number 9,659,884
- Issue date May 23, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20200203313
- Publication date Jun 25, 2020
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190252325
- Publication date Aug 15, 2019
- Powertech Technology Inc.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND A RELATED STACKABLE CHIP PACKAGE
- Publication number 20190244934
- Publication date Aug 8, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE INCLUDING EXTERIOR CONDUCTIVE ELEMENT AND A MANUFAC...
- Publication number 20190214366
- Publication date Jul 11, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20190214367
- Publication date Jul 11, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF...
- Publication number 20180315674
- Publication date Nov 1, 2018
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20180114782
- Publication date Apr 26, 2018
- Powertech Technology Inc.
- Chi-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170047277
- Publication date Feb 16, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE
- Publication number 20170047295
- Publication date Feb 16, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS

Yuan-Fu Lan

Person

Patents Grantslast 30 patents

Manufacturing method and a related stackable chip package

Stacked package structure with encapsulation and redistribution lay...

Stacked package including exterior conductive element and a manufac...

Package process method including disposing a die within a recess of...

Carrier substrate

Patents Applicationslast 30 patents

STACKED PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD AND A RELATED STACKABLE CHIP PACKAGE

STACKED PACKAGE INCLUDING EXTERIOR CONDUCTIVE ELEMENT AND A MANUFAC...

STACKED PACKAGE AND A MANUFACTURING METHOD OF THE SAME

PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF...

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

CARRIER SUBSTRATE