Yuan-Fu Liu

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure
- Patent number 12,002,742
- Issue date Jun 4, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,387,176
- Issue date Jul 12, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,741,513
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer-level package having multiple dies arranged in side-by-side f...
- Patent number 10,515,939
- Issue date Dec 24, 2019
- Mediatek Inc.
- Yi-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having enhanced backside illumination quantum efficiency
- Patent number 10,269,848
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer-level package having one die with its clock source shared by...
- Patent number 10,261,928
- Issue date Apr 16, 2019
- Nephos (Hefei) Co. Ltd.
- Yi-Hung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,163,836
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing a capacitor
- Patent number 10,153,338
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package having asynchronous FIFO buffer used to deal wi...
- Patent number 10,037,293
- Issue date Jul 31, 2018
- Nephos (Hefei) Co. Ltd.
- Yi-Hung Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interconnect structure and method
- Patent number 9,953,920
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 9,875,979
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making integrated circuits including conductive structur...
- Patent number 9,773,701
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a capacitor
- Patent number 9,660,016
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing image sensor having enhanced backside illum...
- Patent number 9,640,582
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MIM capacitors with improved reliability
- Patent number 9,418,999
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film dosimeter and method of determining radiation dose using thereof
- Patent number 9,329,275
- Issue date May 3, 2016
- National Tsing Hua University
- Yuan-Hao Liu
- G01 - MEASURING TESTING
Information Patent Grant
Through substrate via structures and methods of forming the same
- Patent number 9,263,382
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including conductive structures through a subst...
- Patent number 9,059,262
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having enhanced backside illumination quantum efficiency
- Patent number 9,041,841
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interconnect structure and method
- Patent number 9,006,101
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitors with improved reliability
- Patent number 8,889,507
- Issue date Nov 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor for interposers and methods of manufacture thereof
- Patent number 8,878,338
- Issue date Nov 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via structures and methods of forming the same
- Patent number 8,803,322
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including metal-insulator-metal capacitors and...
- Patent number 8,546,235
- Issue date Oct 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for doping a selected portion of a device
- Patent number 8,440,540
- Issue date May 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Chi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory card with electrostatic discharge protection and manufacturi...
- Patent number 7,948,772
- Issue date May 24, 2011
- Orient Semiconductor Electronics
- Yueh-Ming Tung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with bonding pad
- Patent number 7,883,917
- Issue date Feb 8, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Write strategy setting apparatus utilizing shared storage unit and...
- Patent number 7,852,720
- Issue date Dec 14, 2010
- MediaTek Inc.
- Yuan-Chin Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Delay circuit and related method thereof
- Patent number 7,830,192
- Issue date Nov 9, 2010
- Mediatek, Inc.
- Chang-Po Ma
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250056841
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jih-Chao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240274518
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC HEATING MATERIAL PROCESSING DEVICE, SERIES ELECTRIC HEATIN...
- Publication number 20240163978
- Publication date May 16, 2024
- YUH SHAN ENVIRONMENTAL ENGINEERING CO., LTD.
- Huang-Long LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220310498
- Publication date Sep 29, 2022
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20200373267
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200211944
- Publication date Jul 2, 2020
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20190131263
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER-LEVEL PACKAGE HAVING ONE DIE WITH ITS CLOCK SOURCE SHARED BY...
- Publication number 20180300272
- Publication date Oct 18, 2018
- Nephos (Hefei) Co. Ltd.
- Yi-Hung Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20180166409
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Manufacturing Image Sensor Having Enhanced Backside Illum...
- Publication number 20170236863
- Publication date Aug 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CAPACITOR
- Publication number 20170229534
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hua CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20170141059
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE HAVING ASYNCHRONOUS FIFO BUFFER USED TO DEAL WI...
- Publication number 20160239444
- Publication date Aug 18, 2016
- MEDIATEK INC.
- Yi-Hung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER-LEVEL PACKAGE HAVING MULTIPLE DIES ARRANGED IN SIDE-BY-SIDE F...
- Publication number 20160240497
- Publication date Aug 18, 2016
- MEDIATEK INC.
- Yi-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Having Enhanced Backside Illumination Quantum Efficiency
- Publication number 20150279886
- Publication date Oct 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20150235940
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING INTEGRATED CIRCUITS INCLUDING CONDUCTIVE STRUCTUR...
- Publication number 20150228541
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitors with Improved Reliability
- Publication number 20150041874
- Publication date Feb 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CAPACITOR
- Publication number 20150037960
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hua CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20140327151
- Publication date Nov 6, 2014
- Ku-Feng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DOSIMETER AND METHOD OF DETERMINING RADIATION DOSE USING THEREOF
- Publication number 20140110601
- Publication date Apr 24, 2014
- National Tsing Hua University
- Yuan-Hao Liu
- G01 - MEASURING TESTING
Information Patent Application
Interconnect Structure and Method
- Publication number 20140061924
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR FOR INTERPOSERS AND METHODS OF MANUFACTURE THEREOF
- Publication number 20130320493
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hua CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20130093098
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING METAL-INSULATOR-METAL CAPACITORS AND...
- Publication number 20120280358
- Publication date Nov 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING CONDUCTIVE STRUCTURES THROUGH A SUBST...
- Publication number 20120217611
- Publication date Aug 30, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR 3-DIMENSIONAL MICROSCOPIC VISUALIZATION OF THICK BIOLOGI...
- Publication number 20120081518
- Publication date Apr 5, 2012
- Yuan-An Liu
- G02 - OPTICS
Information Patent Application
MICRO PROJECTOR MODULE
- Publication number 20120038839
- Publication date Feb 16, 2012
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Yueh Ming TUNG
- G02 - OPTICS
Information Patent Application
METHOD FOR DOPING A SELECTED PORTION OF A DEVICE
- Publication number 20110081766
- Publication date Apr 7, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Chi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR OBTAINING WRITE STRATEGY PARAMETERS UTILIZING DATA-TO-C...
- Publication number 20100278023
- Publication date Nov 4, 2010
- Chih-Ching Yu
- G11 - INFORMATION STORAGE

Yuan-Fu Liu

Person

Patents Grantslast 30 patents

Semiconductor package structure

Conductive external connector structure and method of forming

Semiconductor package structure

Conductive external connector structure and method of forming

Wafer-level package having multiple dies arranged in side-by-side f...

Image sensor having enhanced backside illumination quantum efficiency

Wafer-level package having one die with its clock source shared by...

Conductive external connector structure and method of forming

Method of manufacturing a capacitor

Wafer-level package having asynchronous FIFO buffer used to deal wi...

Interconnect structure and method

Conductive external connector structure and method of forming

Methods of making integrated circuits including conductive structur...

Method of manufacturing a capacitor

Method of manufacturing image sensor having enhanced backside illum...

MIM capacitors with improved reliability

Film dosimeter and method of determining radiation dose using thereof

Through substrate via structures and methods of forming the same

Integrated circuits including conductive structures through a subst...

Image sensor having enhanced backside illumination quantum efficiency

Interconnect structure and method

MIM capacitors with improved reliability

Capacitor for interposers and methods of manufacture thereof

Through substrate via structures and methods of forming the same

Integrated circuits including metal-insulator-metal capacitors and...

Method for doping a selected portion of a device

Memory card with electrostatic discharge protection and manufacturi...

Semiconductor device with bonding pad

Write strategy setting apparatus utilizing shared storage unit and...

Delay circuit and related method thereof

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRIC HEATING MATERIAL PROCESSING DEVICE, SERIES ELECTRIC HEATIN...

SEMICONDUCTOR PACKAGE STRUCTURE

Conductive External Connector Structure and Method of Forming

SEMICONDUCTOR PACKAGE STRUCTURE

Conductive External Connector Structure and Method of Forming

WAFER-LEVEL PACKAGE HAVING ONE DIE WITH ITS CLOCK SOURCE SHARED BY...

Conductive External Connector Structure and Method of Forming

Method of Manufacturing Image Sensor Having Enhanced Backside Illum...

METHOD OF MANUFACTURING A CAPACITOR

Conductive External Connector Structure and Method of Forming

WAFER-LEVEL PACKAGE HAVING ASYNCHRONOUS FIFO BUFFER USED TO DEAL WI...

WAFER-LEVEL PACKAGE HAVING MULTIPLE DIES ARRANGED IN SIDE-BY-SIDE F...

Image Sensor Having Enhanced Backside Illumination Quantum Efficiency

Interconnect Structure and Method

METHODS OF MAKING INTEGRATED CIRCUITS INCLUDING CONDUCTIVE STRUCTUR...

MIM Capacitors with Improved Reliability

METHOD OF MANUFACTURING A CAPACITOR

THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME

FILM DOSIMETER AND METHOD OF DETERMINING RADIATION DOSE USING THEREOF

Interconnect Structure and Method

CAPACITOR FOR INTERPOSERS AND METHODS OF MANUFACTURE THEREOF

THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUITS INCLUDING METAL-INSULATOR-METAL CAPACITORS AND...

INTEGRATED CIRCUITS INCLUDING CONDUCTIVE STRUCTURES THROUGH A SUBST...

METHOD FOR 3-DIMENSIONAL MICROSCOPIC VISUALIZATION OF THICK BIOLOGI...

MICRO PROJECTOR MODULE

METHOD FOR DOPING A SELECTED PORTION OF A DEVICE

SYSTEMS FOR OBTAINING WRITE STRATEGY PARAMETERS UTILIZING DATA-TO-C...