TREA

Yuan-Hsin CHI

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  • Taichung County, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Clamp ring and method of using clamp ring
    • Patent number 12,142,514
    • Issue date Nov 12, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Chih-Wei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connect structure for semiconductor processing equipment
    • Patent number 12,040,163
    • Issue date Jul 16, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Ming-Sze Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power alarm and fire loading risk reduction for a deposition tool
    • Patent number 12,020,994
    • Issue date Jun 25, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Chih-Wei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer pod transfer assembly
    • Patent number 12,002,699
    • Issue date Jun 4, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chih-Wei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Radio frequency match strap assembly
    • Patent number 11,955,317
    • Issue date Apr 9, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Ming-Sze Chen
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Semiconductor substrate bonding tool and methods of operation
    • Patent number 11,862,482
    • Issue date Jan 2, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yen-Hao Huang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Methods for wafer bonding
    • Patent number 11,851,325
    • Issue date Dec 26, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chien-Wei Chang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Extended acid etch for oxide removal
    • Patent number 11,655,146
    • Issue date May 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Hong-Ta Kuo
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Wafer pod transfer assembly
    • Patent number 11,600,506
    • Issue date Mar 7, 2023
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chih-Wei Chou
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CLAMP RING AND METHOD OF USING CLAMP RING
    • Publication number 20240387233
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Wei CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT
    • Publication number 20240355591
    • Publication date Oct 24, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Ming-Sze Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER POD TRANSFER ASSEMBLY
    • Publication number 20240321616
    • Publication date Sep 26, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chih-Wei CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL
    • Publication number 20240297085
    • Publication date Sep 5, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Wei CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RADIO FREQUENCY MATCH STRAP ASSEMBLY
    • Publication number 20240258072
    • Publication date Aug 1, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Sze Chen
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHODS FOR WAFER BONDING
    • Publication number 20240190701
    • Publication date Jun 13, 2024
    • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    • Chien-Wei CHANG
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    WAFER SHIFT DETECTION
    • Publication number 20240105480
    • Publication date Mar 28, 2024
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    • Ming-Sze Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR WAFER PROCESSING TOOL WITH IMPROVED LEAK CHECK
    • Publication number 20240084445
    • Publication date Mar 14, 2024
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    • Chih-Wei Chou
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION
    • Publication number 20240087915
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yen-Hao HUANG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT
    • Publication number 20240021416
    • Publication date Jan 18, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Ming-Sze Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
    • Publication number 20230383399
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ming-Yi SHEN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    TRANSFER BLADE FOR ROBOT
    • Publication number 20230373100
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Wei CHOU
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Application

    WORKPIECE SUPPORT
    • Publication number 20230375945
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ming-Yi SHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EXTENDED ACID ETCH FOR OXIDE REMOVAL
    • Publication number 20230264949
    • Publication date Aug 24, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hong-Ta KUO
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    WAFER POD TRANSFER ASSEMBLY
    • Publication number 20230207365
    • Publication date Jun 29, 2023
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chih-Wei CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLAMP RING AND METHOD OF USING CLAMP RING
    • Publication number 20230068139
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Wei CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR APPARATUS FOR DEPOSITION PROCESS
    • Publication number 20230065818
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Wei Chou
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    RADIO FREQUENCY MATCH STRAP ASSEMBLY
    • Publication number 20220406569
    • Publication date Dec 22, 2022
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    • Ming-Sze Chen
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
    • Publication number 20220367405
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hong-Ta Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER POD TRANSFER ASSEMBLY
    • Publication number 20220344191
    • Publication date Oct 27, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chih-Wei CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER ALARM AND FIRE LOADING RISK REDUCTION FOR A DEPOSITION TOOL
    • Publication number 20220301947
    • Publication date Sep 22, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chih-Wei CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION
    • Publication number 20220293436
    • Publication date Sep 15, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Yen-Hao HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
    • Publication number 20220275500
    • Publication date Sep 1, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ming-Yi SHEN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    EXTENDED ACID ETCH FOR OXIDE REMOVAL
    • Publication number 20220153574
    • Publication date May 19, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Hong-Ta KUO
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    METHODS FOR WAFER BONDING
    • Publication number 20200172393
    • Publication date Jun 4, 2020
    • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    • Chien-Wei CHANG
    • B81 - MICRO-STRUCTURAL TECHNOLOGY