Yuan-Hung Hsu

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,255,165
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,107,055
- Issue date Oct 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,100,642
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,027,484
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,881,459
- Issue date Jan 23, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating carrier structure
- Patent number 11,792,938
- Issue date Oct 17, 2023
- Silicon Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,742,296
- Issue date Aug 29, 2023
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of defect inspection
- Patent number 11,624,985
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Ching Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,610,850
- Issue date Mar 21, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,532,528
- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stack structure and method for manufacturing the same
- Patent number 11,516,925
- Issue date Nov 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,482,470
- Issue date Oct 25, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, manufacturing method thereof and conductive str...
- Patent number 11,410,954
- Issue date Aug 9, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 11,102,890
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Ying-Chang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,069,661
- Issue date Jul 20, 2021
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package carrier structure thereof, and method for fabric...
- Patent number 10,863,626
- Issue date Dec 8, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of defect inspection
- Patent number 10,795,270
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Ching Yu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250079255
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250046670
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...
- Publication number 20240321798
- Publication date Sep 26, 2024
- SILICONWARE PRECISION INDUST RIES CO., LT D.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240162169
- Publication date May 16, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230361091
- Publication date Nov 9, 2023
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268262
- Publication date Aug 24, 2023
- Siliconware Precision Industries Co., Ltd.
- Li-Chu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20230187382
- Publication date Jun 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...
- Publication number 20220392861
- Publication date Dec 8, 2022
- SILICONWARE PRECISION INDUST RIES CO., LT D.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220336323
- Publication date Oct 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220181225
- Publication date Jun 9, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220173052
- Publication date Jun 2, 2022
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148975
- Publication date May 12, 2022
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, MANUFACTURING METHOD THEREOF AND CONDUCTIVE STR...
- Publication number 20210320076
- Publication date Oct 14, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20210287962
- Publication date Sep 16, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20210082837
- Publication date Mar 18, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CARRIER STRUCTURE
- Publication number 20210068260
- Publication date Mar 4, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DEFECT INSPECTION
- Publication number 20210018848
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ta-Ching YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200258871
- Publication date Aug 13, 2020
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200093006
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Ying-Chang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DEFECT INSPECTION
- Publication number 20190064675
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ta-Ching YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180288886
- Publication date Oct 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Yuan-Hung Hsu

Person

Patents Grantslast 30 patents

Electronic package and carrier thereof and method for manufacturing...

Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

Electronic package and carrier thereof and method for manufacturing...

Electronic package and fabrication method thereof

Method for fabricating carrier structure

Electronic package and manufacturing method thereof

Methods of defect inspection

Electronic package and fabrication method thereof

Electronic package and manufacturing method thereof

Package stack structure and method for manufacturing the same

Electronic package and fabrication method thereof

Electronic package, manufacturing method thereof and conductive str...

Electronic package and method for manufacturing the same

Electronic package

Electronic package carrier structure thereof, and method for fabric...

Methods of defect inspection

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, MANUFACTURING METHOD THEREOF AND CONDUCTIVE STR...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING CARRIER STRUCTURE

METHODS OF DEFECT INSPECTION

PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHODS OF DEFECT INSPECTION

PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME