Yuan Lu

Follow

Person

US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level interconnect for high mechanical reliability applications
- Patent number 8,754,524
- Issue date Jun 17, 2014
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump interconnect
- Patent number 8,446,019
- Issue date May 21, 2013
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect
- Patent number 8,188,606
- Issue date May 29, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level interconnect for high mechanical reliability applications
- Patent number 8,143,722
- Issue date Mar 27, 2012
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump interconnect for improved mechanical and thermo-mechani...
- Patent number 7,973,418
- Issue date Jul 5, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20120228765
- Publication date Sep 13, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
- Publication number 20120146219
- Publication date Jun 14, 2012
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20110186995
- Publication date Aug 4, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER
- Publication number 20090014869
- Publication date Jan 15, 2009
- Joan K. Vrtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANI...
- Publication number 20080308934
- Publication date Dec 18, 2008
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
- Publication number 20080083986
- Publication date Apr 10, 2008
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR