Yuan-Ping Tseng

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circular polarization antenna structure with a dual-layer ceramic a...
- Patent number 8,094,075
- Issue date Jan 10, 2012
- Inpaq Technology Co., Ltd.
- Ta-Fu Cheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating anisotropic conductive substrate
- Patent number 7,140,101
- Issue date Nov 28, 2006
- Chipmos Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing probes of a probe card
- Patent number 7,005,054
- Issue date Feb 28, 2006
- Chipmos Technologies (Bermuda) Ltd.
- S. J. Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 6,853,205
- Issue date Feb 8, 2005
- Chipmos Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Modularized probe card with coaxial transmitters
- Patent number 6,812,720
- Issue date Nov 2, 2004
- Chipmos Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Modularized probe card with compressible electrical connection device
- Patent number 6,781,392
- Issue date Aug 24, 2004
- Chipmos Technologies Ltd.
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for performing memory repair analysis
- Patent number 6,751,760
- Issue date Jun 15, 2004
- ChipMOS Technologies Inc.
- Yuan-Ping Tseng
- G11 - INFORMATION STORAGE
Information Patent Grant
Flip-chip type semiconductor device for reducing signal skew
- Patent number 6,686,615
- Issue date Feb 3, 2004
- Chipmos Technologies (Bermuda) Ltd.
- S. J. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular probe card assembly
- Patent number 6,621,710
- Issue date Sep 16, 2003
- ChipMOS Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging for making flip-chips
- Patent number 6,605,480
- Issue date Aug 12, 2003
- ChipMOS Technologies Inc.
- An-Hong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer designed to avoid probed marks while testing
- Patent number 6,534,853
- Issue date Mar 18, 2003
- ChipMOS Technologies Inc.
- An-Hong Liu
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing process of semiconductor devices
- Patent number 6,395,622
- Issue date May 28, 2002
- Chipmos Technologies Inc.
- An-Hong Liu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
PLATE ANTENNA MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140097989
- Publication date Apr 10, 2014
- INPAQ TECHNOLOGY CO., LTD.
- TA-FU CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20130009143
- Publication date Jan 10, 2013
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR POLARIZATION ANTENNA STRUCTURE WITH A DUAL-LAYER CERAMIC A...
- Publication number 20100164809
- Publication date Jul 1, 2010
- INPAQ TECHNOLOGY CO., LTD.
- TA-FU CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating wafer-level chip scale packages
- Publication number 20050070049
- Publication date Mar 31, 2005
- S. J. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating anisotropic conductive substrate
- Publication number 20050066521
- Publication date Mar 31, 2005
- S. J. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20050012513
- Publication date Jan 20, 2005
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing process of memory module with direct die-attachment
- Publication number 20050014308
- Publication date Jan 20, 2005
- Yuan-Ping Tseng
- G11 - INFORMATION STORAGE
Information Patent Application
MODULARIZED PROBE CARD WITH COAXIAL TRANSMITTERS
- Publication number 20040207420
- Publication date Oct 21, 2004
- S. J. Cheng
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing probes of a probe card
- Publication number 20040035706
- Publication date Feb 26, 2004
- ChipMOS Technologies (Bermuda) Ltd. and ChipMOS TECHNOLOGIES INC.
- S. J. Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Probe card with full wafer contact configuration
- Publication number 20040012405
- Publication date Jan 22, 2004
- ChipMOS Technologies (Bermuda) Ltd.
- S. J. Cheng
- G01 - MEASURING TESTING
Information Patent Application
System and method for avoiding waiting repair analysis for semicond...
- Publication number 20030101388
- Publication date May 29, 2003
- ChipMOS TECHNOLOGIES INC.
- Yuan-Ping Tseng
- G11 - INFORMATION STORAGE
Information Patent Application
WAFER LEVEL PACKAGING FOR MAKING FLIP-CHIPS
- Publication number 20030098494
- Publication date May 29, 2003
- ChipMOS TECHNOLOGIES INC.
- An-Hong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for performing memory repair analysis
- Publication number 20030097626
- Publication date May 22, 2003
- ChipMOS TECHNOLOGIES INC.
- Yuan-Ping Tseng
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR WAFER DESIGNED TO AVOID PROBED MARKS WHILE TESTING
- Publication number 20020180026
- Publication date Dec 5, 2002
- ChipMOS TECHNOLOGIES INC.
- An-Hong Liu
- G01 - MEASURING TESTING

Yuan-Ping Tseng

Person

Patents Grantslast 30 patents

Circular polarization antenna structure with a dual-layer ceramic a...

Method for fabricating anisotropic conductive substrate

Method for manufacturing probes of a probe card

Probe card assembly

Modularized probe card with coaxial transmitters

Modularized probe card with compressible electrical connection device

Method and system for performing memory repair analysis

Flip-chip type semiconductor device for reducing signal skew

Modular probe card assembly

Wafer level packaging for making flip-chips

Semiconductor wafer designed to avoid probed marks while testing

Manufacturing process of semiconductor devices

Patents Applicationslast 30 patents

PLATE ANTENNA MODULE AND METHOD OF MANUFACTURING THE SAME

PHOTO SENSOR AND METHOD OF FABRICATING THE SAME

CIRCULAR POLARIZATION ANTENNA STRUCTURE WITH A DUAL-LAYER CERAMIC A...

Method for fabricating wafer-level chip scale packages

Method for fabricating anisotropic conductive substrate

PROBE CARD ASSEMBLY

Manufacturing process of memory module with direct die-attachment

MODULARIZED PROBE CARD WITH COAXIAL TRANSMITTERS

Method for manufacturing probes of a probe card

Probe card with full wafer contact configuration

System and method for avoiding waiting repair analysis for semicond...

WAFER LEVEL PACKAGING FOR MAKING FLIP-CHIPS

Method and system for performing memory repair analysis

SEMICONDUCTOR WAFER DESIGNED TO AVOID PROBED MARKS WHILE TESTING