Yuan-Ping YEH

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Taichung City, TW

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250132236
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Pao-Hung TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240332149
- Publication date Oct 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Yuan-Chang NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282689
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chan-Yu YEH
- H01 - BASIC ELECTRIC ELEMENTS