Yuan-Tien Tu

Person

Puzih City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric cap structure in semiconductor devices and methods of ma...
- Patent number 12,183,633
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, memory cell including connecting structure ha...
- Patent number 12,120,968
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive capping for work function layer and method forming same
- Patent number 12,119,386
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed contacts at line end and methods forming same
- Patent number 12,107,007
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 12,107,003
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device interconnects and methods of formation
- Patent number 12,087,832
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, memory cell and method of forming the same
- Patent number 12,041,790
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chao Lin
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,996,321
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 11,967,622
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for semiconductor devices and methods of forming the same
- Patent number 11,961,893
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall protection for PCRAM device
- Patent number 11,818,967
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chao Lin
Information Patent Grant
Semiconductor device structure with conductive via structure and me...
- Patent number 11,810,919
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jyun-De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of via opening
- Patent number 11,749,732
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 11,664,272
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, memory cell and method of forming the same
- Patent number 11,594,576
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall protection for PCRAM device
- Patent number 11,362,277
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned insulated film for high-K metal gate device
- Patent number 11,094,545
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned insulated film for high-k metal gate device
- Patent number 10,388,531
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned insulated film for high-k metal gate device
- Patent number 9,779,947
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned insulated film for high-k metal gate device
- Patent number 9,252,224
- Issue date Feb 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned insulated film for high-k metal gate device
- Patent number 8,822,283
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contacts for a semiconductor device
- Patent number 8,222,136
- Issue date Jul 17, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Tien Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20240395607
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
- Publication number 20240387266
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION
- Publication number 20240387656
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240373764
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CAPPING FOR WORK FUNCTION LAYER AND METHOD FORMING SAME
- Publication number 20240371956
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240334713
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240312833
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240250143
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME
- Publication number 20240234527
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE
- Publication number 20240079409
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240040938
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL PROTECTION FOR PCRAM DEVICE
- Publication number 20240023462
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chao LIN
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION
- Publication number 20230387227
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF VIA OPENING
- Publication number 20230361185
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERAM DEVICE AND METHOD OF MANUFACTURING
- Publication number 20230363177
- Publication date Nov 9, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20230298934
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BETWEEN GATE AND SOURCE/DRAIN FEATURE
- Publication number 20230197802
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MEMORY CELL AND METHOD OF FORMING THE SAME
- Publication number 20230180486
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
Information Patent Application
SEMICONDUCTOR DEVICE, MEMORY CELL AND METHOD OF FORMING THE SAME
- Publication number 20230065500
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONTACT...
- Publication number 20230033570
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220406653
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND ME...
- Publication number 20220406777
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME
- Publication number 20220359684
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
- Publication number 20220359287
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contacts for Semiconductor Devices and Methods of Forming the Same
- Publication number 20220352338
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20220344206
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION
- Publication number 20220320300
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL PROTECTION FOR PCRAM DEVICE
- Publication number 20220310919
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Capping For Work Function Layer and Method Forming Same
- Publication number 20220310814
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF VIA OPENING
- Publication number 20220102511
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS

Yuan-Tien Tu

Person

Patents Grantslast 30 patents

Dielectric cap structure in semiconductor devices and methods of ma...

Semiconductor device, memory cell including connecting structure ha...

Conductive capping for work function layer and method forming same

Recessed contacts at line end and methods forming same

Etch profile control of gate contact opening

Semiconductor device interconnects and methods of formation

Semiconductor device, memory cell and method of forming the same

Semiconductor structure and method for forming the same

Inter block for recessed contacts and methods forming same

Contacts for semiconductor devices and methods of forming the same

Sidewall protection for PCRAM device

Semiconductor device structure with conductive via structure and me...

Etch profile control of via opening

Etch profile control of gate contact opening

Semiconductor device, memory cell and method of forming the same

Sidewall protection for PCRAM device

Self-aligned insulated film for high-K metal gate device

Self-aligned insulated film for high-k metal gate device

Self-aligned insulated film for high-k metal gate device

Self-aligned insulated film for high-k metal gate device

Self-aligned insulated film for high-k metal gate device

Method of forming contacts for a semiconductor device

Patents Applicationslast 30 patents

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME

SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE

CONDUCTIVE CAPPING FOR WORK FUNCTION LAYER AND METHOD FORMING SAME

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE

MEMORY DEVICE AND FABRICATION METHOD THEREOF

SIDEWALL PROTECTION FOR PCRAM DEVICE

SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION

ETCH PROFILE CONTROL OF VIA OPENING

FERAM DEVICE AND METHOD OF MANUFACTURING

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

CONNECTION BETWEEN GATE AND SOURCE/DRAIN FEATURE

SEMICONDUCTOR DEVICE, MEMORY CELL AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE, MEMORY CELL AND METHOD OF FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONTACT...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND ME...

INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME

RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME

Contacts for Semiconductor Devices and Methods of Forming the Same

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION

SIDEWALL PROTECTION FOR PCRAM DEVICE

Conductive Capping For Work Function Layer and Method Forming Same

ETCH PROFILE CONTROL OF VIA OPENING