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Tianjin, CN
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last 30 patents
Information
Patent Grant
Lead frame with dummy leads for burr mitigation during encapsulation
Patent number
10,037,935
Issue date
Jul 31, 2018
NXP USA, INC.
Xingshou Pang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate interconnections for packaged semiconductor device
Patent number
9,997,445
Issue date
Jun 12, 2018
NXP USA, INC.
Kai Yun Yow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame based semiconductor die package
Patent number
8,901,721
Issue date
Dec 2, 2014
FREESCALE SEMICONDUCTOR, INC.
Zhigang Bai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE
Publication number
20180114748
Publication date
Apr 26, 2018
NXP USA, Inc.
Kai Yun Yow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE
Publication number
20140361421
Publication date
Dec 11, 2014
Zhigang Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
Publication number
20130249071
Publication date
Sep 26, 2013
Jinzhong Yao
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE
Publication number
20080283980
Publication date
Nov 20, 2008
FREESCALE SEMICONDUCTOR, INC.
Wei Gao
H01 - BASIC ELECTRIC ELEMENTS